| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 闪存大小 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M2S150-1FCS536IC SOC CORTEX-M3 166MHZ 536BGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | 0°C ~ 85°C (TJ) | - | - | 536-CSPBGA (16x16) |
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M2S150-1FCSG536IC SOC CORTEX-M3 166MHZ 536BGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | 0°C ~ 85°C (TJ) | - | - | 536-CSPBGA (16x16) |
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M2S150-FCS536IIC SOC CORTEX-M3 166MHZ 536BGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | -40°C ~ 100°C (TJ) | - | - | 536-CSPBGA (16x16) |
|
M2S150-FCSG536IIC SOC CORTEX-M3 166MHZ 536BGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 536-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | -40°C ~ 100°C (TJ) | - | - | 536-CSPBGA (16x16) |
|
M2S150-1FCV484IIC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | -40°C ~ 100°C (TJ) | - | - | 484-FBGA (19x19) |
|
M2S150-1FCVG484IIC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | -40°C ~ 100°C (TJ) | - | - | 484-FBGA (19x19) |
|
M2S150TS-FCV484IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
|
M2S150TS-FCVG484IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
|
M2S150T-1FC1152IC SOC CORTEX-M3 166MHZ 1152BGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
M2S150T-1FCG1152IC SOC CORTEX-M3 166MHZ 1152BGA Microchip Technology |
0 | - |
|
数据表 |
SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 512KB | 0°C ~ 85°C (TJ) | - | - | 1152-FCBGA (35x35) |