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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCZU2EG-2SFVC784I

XCZU2EG-2SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

20 -
XCZU2EG-2SFVC784I

数据表

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells - -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU3EG-1UBVA530I

XCZU3EG-1UBVA530I

IC SOC CORTEX-A53 530BGA

AMD

6 -
XCZU3EG-1UBVA530I

数据表

- 530-WFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - -40°C ~ 100°C (TJ) - - 530-FCBGA (16x9.5)
XCZU3CG-2UBVA530I

XCZU3CG-2UBVA530I

IC SOC CORTEX-A53 530BGA

AMD

12 -
XCZU3CG-2UBVA530I

数据表

- 530-WFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - -40°C ~ 100°C (TJ) - - 530-FCBGA (16x9.5)
XAZU3EG-1SFVC784I

XAZU3EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

7 -
XAZU3EG-1SFVC784I

数据表

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 1.8MB DMA, WDT CANbus, I2C, SPI, UART/USART, USB 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU4EG-1SFVC784E

XCZU4EG-1SFVC784E

IC SOC CORTEX-A53 784FCBGA

AMD

22 -
XCZU4EG-1SFVC784E

数据表

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - 0°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU4EV-1SFVC784E

XCZU4EV-1SFVC784E

IC SOC CORTEX-A53 784FCBGA

AMD

15 -
XCZU4EV-1SFVC784E

数据表

Zynq® UltraScale+™ MPSoC EV 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - 0°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU4CG-1FBVB900E

XCZU4CG-1FBVB900E

IC SOC CORTEX-A53 900FCBGA

AMD

5 -
XCZU4CG-1FBVB900E

数据表

Zynq® UltraScale+™ MPSoC CG 900-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XC7Z035-2FFG900I

XC7Z035-2FFG900I

IC SOC CORTEX-A9 800MHZ 900FCBGA

AMD

4 -
XC7Z035-2FFG900I

数据表

Zynq®-7000 900-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 275K Logic Cells - -40°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCZU9EG-1FFVC900E

XCZU9EG-1FFVC900E

IC SOC CORTEX-A53 900FCBGA

AMD

3 -
XCZU9EG-1FFVC900E

数据表

Zynq® UltraScale+™ MPSoC EG 900-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells - 0°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCVM1302-2HSINBVB1024

XCVM1302-2HSINBVB1024

IC VERSALPRIME ACAP FPGA 1024BGA

AMD

3 -
XCVM1302-2HSINBVB1024

数据表

Versal™ Prime 1024-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 70k Logic Cells - -40°C ~ 100°C (TJ) - - 1024-BGA (31x31)
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