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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XAZU2EG-1SFVC784I

XAZU2EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

31 -
XAZU2EG-1SFVC784I

数据表

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 1.2MB DMA, WDT CANbus, I2C, SPI, UART/USART, USB 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 103K+ Logic Cells - -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU1EG-2UBVA494I

XCZU1EG-2UBVA494I

IC ZUP MPSOC EG A53 FPGA 494BGA

AMD

126 -
XCZU1EG-2UBVA494I

数据表

Zynq® UltraScale+™ MPSoC EG 494-WFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT - 533MHz, 600MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 81K+ Logic Cells - -40°C ~ 100°C (TJ) - - 494-FCBGA (14x14)
XA7Z030-1FBV484Q

XA7Z030-1FBV484Q

IC SOC CORTEX-A9 667MHZ 484FCBGA

AMD

60 -
XA7Z030-1FBV484Q

数据表

Zynq®-7000 XA 484-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells - -40°C ~ 125°C (TJ) Automotive AEC-Q100 484-FCBGA (23x23)
XC7Z030-1FBG676I

XC7Z030-1FBG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD

2 -
XC7Z030-1FBG676I

数据表

Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells - -40°C ~ 100°C (TJ) - - 676-FCBGA (27x27)
XC7Z030-2SBG485I

XC7Z030-2SBG485I

IC SOC CORTEX-A9 800MHZ 485FCBGA

AMD

15 -
XC7Z030-2SBG485I

数据表

Zynq®-7000 484-FBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 125K Logic Cells - -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XC7Z030-1FFG676I

XC7Z030-1FFG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD

22 -
XC7Z030-1FFG676I

数据表

Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells - -40°C ~ 100°C (TJ) - - 676-FCBGA (27x27)
XCZU3EG-1SFVC784I

XCZU3EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

AMD

3 -
XCZU3EG-1SFVC784I

数据表

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - -40°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU9EG-2FFVB1156I

XCZU9EG-2FFVB1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

10 -
XCZU9EG-2FFVB1156I

数据表

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU1CG-1SBVA484I

XCZU1CG-1SBVA484I

IC ZUP MPSOC CG A53 FPGA 484BGA

AMD

4 -
XCZU1CG-1SBVA484I

数据表

Zynq® UltraScale+™ MPSoC CG 484-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT - 500MHz, 1.2GHz - - -40°C ~ 100°C (TJ) - - 484-FCBGA (19x19)
XC7Z030-1FBG484I

XC7Z030-1FBG484I

IC SOC CORTEX-A9 667MHZ 484FCBGA

AMD

9 -
XC7Z030-1FBG484I

数据表

Zynq®-7000 484-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 125K Logic Cells - -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
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