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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCZU17EG-2FFVC1760I

XCZU17EG-2FFVC1760I

IC SOC CORTEX-A53 1760FCBGA

AMD

0 -
XCZU17EG-2FFVC1760I

数据表

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU17EG-2FFVE1924I

XCZU17EG-2FFVE1924I

IC SOC CORTEX-A53 1924FCBGA

AMD

0 -
XCZU17EG-2FFVE1924I

数据表

Zynq® UltraScale+™ MPSoC EG 1924-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1924-FCBGA (45x45)
XCZU17EG-L2FFVC1760E

XCZU17EG-L2FFVC1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

0 -
XCZU17EG-L2FFVC1760E

数据表

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU15EG-3FFVB1156E

XCZU15EG-3FFVB1156E

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU15EG-3FFVB1156E

数据表

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 667MHz, 1.5GHz Zynq®UltraScale+™ FPGA, 747K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU17EG-3FFVB1517E

XCZU17EG-3FFVB1517E

IC SOC CORTEX-A53 1517FCBGA

AMD

0 -
XCZU17EG-3FFVB1517E

数据表

Zynq® UltraScale+™ MPSoC EG 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 667MHz, 1.5GHz Zynq®UltraScale+™ FPGA, 926K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCVM1402-2LLENBVB1024

XCVM1402-2LLENBVB1024

IC VERSALPRIME ACAP FPGA 1024BGA

AMD

0 -
XCVM1402-2LLENBVB1024

数据表

Versal™ Prime 1024-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ Prime FPGA, 1.2M Logic Cells - 0°C ~ 100°C (TJ) - - 1024-BGA (31x31)
XCVM1402-1LLINBVB1024

XCVM1402-1LLINBVB1024

IC VERSALPRIME ACAP FPGA 1024BGA

AMD

0 -
XCVM1402-1LLINBVB1024

数据表

Versal™ Prime 1024-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Prime FPGA, 1.2M Logic Cells - -40°C ~ 100°C (TJ) - - 1024-BGA (31x31)
XCVM1502-1LSINFVB1369

XCVM1502-1LSINFVB1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

0 -
XCVM1502-1LSINFVB1369

数据表

Versal™ Prime 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Prime FPGA, 1M Logic Cells - -40°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
XCVM1502-1MLINFVB1369

XCVM1502-1MLINFVB1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

0 -
XCVM1502-1MLINFVB1369

数据表

Versal™ Prime 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 1M Logic Cells - -40°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
XCVM1502-2MLENFVB1369

XCVM1502-2MLENFVB1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

0 -
XCVM1502-2MLENFVB1369

数据表

Versal™ Prime 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 1M Logic Cells - 0°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
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