富聪科技订单满¥1000免运费
关注我们:

系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCZU9EG-L1FFVB1156I

XCZU9EG-L1FFVB1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU9EG-L1FFVB1156I

数据表

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Bulk Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU9EG-2FFVC900I

XCZU9EG-2FFVC900I

IC SOC CORTEX-A53 900FCBGA

AMD

0 -
XCZU9EG-2FFVC900I

数据表

Zynq® UltraScale+™ MPSoC EG 900-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 599K+ Logic Cells - -40°C ~ 100°C (TJ) - - 900-FCBGA (31x31)
XCVM1302-2LSENSVF1369

XCVM1302-2LSENSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

0 -
XCVM1302-2LSENSVF1369

数据表

Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ Prime FPGA, 70k Logic Cells - 0°C ~ 100°C (TJ) - - 1369-BGA (35x35)
XCVM1302-2MLENSVF1369

XCVM1302-2MLENSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

0 -
XCVM1302-2MLENSVF1369

数据表

Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 70k Logic Cells - 0°C ~ 100°C (TJ) - - 1369-BGA (35x35)
XCVM1302-1MLINSVF1369

XCVM1302-1MLINSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

0 -
XCVM1302-1MLINSVF1369

数据表

Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ Prime FPGA, 70k Logic Cells - -40°C ~ 100°C (TJ) - - 1369-BGA (35x35)
XCVM1302-1LSINSVF1369

XCVM1302-1LSINSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

AMD

0 -
XCVM1302-1LSINSVF1369

数据表

Versal™ Prime 1369-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Prime FPGA, 70k Logic Cells - -40°C ~ 100°C (TJ) - - 1369-BGA (35x35)
XCVM1302-2MSINBVB1024

XCVM1302-2MSINBVB1024

IC VERSALPRIME ACAP FPGA 1024BGA

AMD

0 -
XCVM1302-2MSINBVB1024

数据表

Versal™ Prime 1024-BFBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ Prime FPGA, 70k Logic Cells - -40°C ~ 100°C (TJ) - - 1024-BGA (31x31)
XCZU11EG-1FFVC1156I

XCZU11EG-1FFVC1156I

IC SOC CORTEX-A53 1156FCBGA

AMD

0 -
XCZU11EG-1FFVC1156I

数据表

Zynq® UltraScale+™ MPSoC EG 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 653K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU7EG-2FFVF1517I

XCZU7EG-2FFVF1517I

IC SOC CORTEX-A53 1517FCBGA

AMD

0 -
XCZU7EG-2FFVF1517I

数据表

Zynq® UltraScale+™ MPSoC EG 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 504K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU11EG-1FFVC1760E

XCZU11EG-1FFVC1760E

IC SOC CORTEX-A53 1760FCBGA

AMD

0 -
XCZU11EG-1FFVC1760E

数据表

Zynq® UltraScale+™ MPSoC EG 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 600MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 653K+ Logic Cells - 0°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
共 1129 条记录«上一页1... 4647484950515253...113下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户