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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCZU3EG-L2SFVC784E

XCZU3EG-L2SFVC784E

IC SOC CORTEX-A53 784FCBGA

AMD

0 -
XCZU3EG-L2SFVC784E

数据表

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 600MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - 0°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XCZU3TCG-L2SFVD784E

XCZU3TCG-L2SFVD784E

XCZU3TCG-L2SFVD784E

AMD

0 -
XCZU3TCG-L2SFVD784E

数据表

- - Bulk Active - - - - - - - - - - - -
XCZU4CG-1SFVC784E

XCZU4CG-1SFVC784E

IC SOC CORTEX-A53 784FCBGA

AMD

0 -
XCZU4CG-1SFVC784E

数据表

Zynq® UltraScale+™ MPSoC CG 784-BFBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - 0°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
XC7Z045-1FBG676CES

XC7Z045-1FBG676CES

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD

0 -
XC7Z045-1FBG676CES

数据表

Zynq®-7000 676-BBGA, FCBGA Tray Obsolete MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 350K Logic Cells - 0°C ~ 85°C (TJ) - - 676-FCBGA (27x27)
XAZU3EG-1SBVA484Q

XAZU3EG-1SBVA484Q

XAZU3EG-1SBVA484Q

AMD

0 -
XAZU3EG-1SBVA484Q

数据表

Zynq® UltraScale+™ MPSoC EG 484-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ 1.8MB DMA, WDT CANbus, I2C, SPI, UART/USART, USB 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - -40°C ~ 125°C (TJ) - - 484-FCBGA (19x19)
XAZU3EG-1SFVA625Q

XAZU3EG-1SFVA625Q

IC SOC CORTEX-A53 625FCBGA

AMD

0 -
XAZU3EG-1SFVA625Q

数据表

Zynq® UltraScale+™ MPSoC EG 625-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 1.8MB DMA, WDT CANbus, I2C, SPI, UART/USART, USB 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - -40°C ~ 125°C (TJ) - - 625-FCBGA (21x21)
XAZU3EG-1SFVC784Q

XAZU3EG-1SFVC784Q

IC SOC CORTEX-A53 784FCBGA

AMD

0 -
XAZU3EG-1SFVC784Q

数据表

Zynq® UltraScale+™ MPSoC EG 784-BFBGA, FCBGA Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 1.8MB DMA, WDT CANbus, I2C, SPI, UART/USART, USB 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - -40°C ~ 125°C (TJ) - - 784-FCBGA (23x23)
XC7Z035-1FBG676C

XC7Z035-1FBG676C

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD

0 -
XC7Z035-1FBG676C

数据表

Zynq®-7000 676-BBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 667MHz Kintex™-7 FPGA, 275K Logic Cells - 0°C ~ 85°C (TJ) - - 676-FCBGA (27x27)
XC7Z045-2FBG676CES

XC7Z045-2FBG676CES

IC SOC CORTEX-A9 800MHZ 676FCBGA

AMD

0 -
XC7Z045-2FBG676CES

数据表

Zynq®-7000 676-BBGA, FCBGA Tray Obsolete MCU, FPGA Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB DMA CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz Kintex™-7 FPGA, 350K Logic Cells - 0°C ~ 85°C (TJ) - - 676-FCBGA (27x27)
XCZU4CG-2SFVC784E

XCZU4CG-2SFVC784E

IC SOC CORTEX-A53 784FCBGA

AMD

0 -
XCZU4CG-2SFVC784E

数据表

Zynq® UltraScale+™ MPSoC CG 784-BFBGA, FCBGA Tray Active MCU, FPGA Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.3GHz Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - 0°C ~ 100°C (TJ) - - 784-FCBGA (23x23)
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