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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGIB027R31A1E2V

AGIB027R31A1E2V

AGIB027R31A1E2V

Intel

0 -
AGIB027R31A1E2V

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA027R24C2I1V

AGFA027R24C2I1V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFA027R24C2I1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFA027R24C2I1VB

AGFA027R24C2I1VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFA027R24C2I1VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB027R24C2I1V

AGFB027R24C2I1V

IC FPGA AGILEX-F 2340FBGA

Intel

0 -
AGFB027R24C2I1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGIB027R31B1E2V

AGIB027R31B1E2V

IC FPGA AGILEX-I 3184FBGA

Intel

0 -
AGIB027R31B1E2V

数据表

Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGIB027R31B2E1V

AGIB027R31B2E1V

IC FPGA AGILEX-I 3184FBGA

Intel

0 -
AGIB027R31B2E1V

数据表

Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGIB027R31B1E2VB

AGIB027R31B1E2VB

IC FPGA AGILEX-I 3184BGA

Intel

0 -
AGIB027R31B1E2VB

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB027R31B2E1VB

AGIB027R31B2E1VB

IC FPGA AGILEX-I 3184BGA

Intel

0 -
AGIB027R31B2E1VB

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB027R24C2I1VB

AGFB027R24C2I1VB

AGFB027R24C2I1VB

Intel

0 -
AGFB027R24C2I1VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGIB027R29A2I3V

AGIB027R29A2I3V

IC FPGA AGILEX-I 2957BGA

Intel

0 -
AGIB027R29A2I3V

数据表

Agilex I 2957-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - 2957-BGA (56x45)
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