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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGFC023R31C2I3E

AGFC023R31C2I3E

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFC023R31C2I3E

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFC023R31C2I2V

AGFC023R31C2I2V

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFC023R31C2I2V

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFC023R31C2I2VB

AGFC023R31C2I2VB

IC FPGA AGILEX-F 3184BGA

Intel

0 -
AGFC023R31C2I2VB

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB022R29A2I3V

AGIB022R29A2I3V

IC FPGA AGILEX-I 2957BGA

Intel

0 -
AGIB022R29A2I3V

数据表

Agilex I 2957-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - -40°C ~ 100°C (TJ) - - 2957-BGA (56x45)
AGFD023R31C2I2V

AGFD023R31C2I2V

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFD023R31C2I2V

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFD023R31C2I3E

AGFD023R31C2I3E

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFD023R31C2I3E

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFD023R31C2I2VB

AGFD023R31C2I2VB

IC FPGA AGILEX-F 3184BGA

Intel

0 -
AGFD023R31C2I2VB

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB027R31A2E2V

AGIB027R31A2E2V

AGIB027R31A2E2V

Intel

0 -
AGIB027R31A2E2V

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
1SX250HU1F50I2LG

1SX250HU1F50I2LG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX250HU1F50I2LG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGIB019R18A1I1V

AGIB019R18A1I1V

IC FPGA AGILEX-I 1805FBGA

Intel

0 -
AGIB019R18A1I1V

数据表

Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
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