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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGFD019R31C2I2VB

AGFD019R31C2I2VB

IC FPGA AGILEX-F 3184BGA

Intel

0 -
AGFD019R31C2I2VB

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFA027R25A2E4X

AGFA027R25A2E4X

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFA027R25A2E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFA022R31C3E4X

AGFA022R31C3E4X

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFA022R31C3E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB027R25A2E4X

AGFB027R25A2E4X

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFB027R25A2E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB022R31C3E4X

AGFB022R31C3E4X

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFB022R31C3E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
1SX280LU2F50I1VG

1SX280LU2F50I1VG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

0 -
1SX280LU2F50I1VG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX280HU1F50I2VG

1SX280HU1F50I2VG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX280HU1F50I2VG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX280HU2F50I1VG

1SX280HU2F50I1VG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX280HU2F50I1VG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements - -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGFC023R24C2I2VB

AGFC023R24C2I2VB

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFC023R24C2I2VB

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFC023R24C2I3E

AGFC023R24C2I3E

IC FPGA AGILEX-F 2340BGA

Intel

0 -
AGFC023R24C2I3E

数据表

Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
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