富聪科技订单满¥1000免运费
关注我们:

系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
1SX250HU3F50E3XG

1SX250HU3F50E3XG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX250HU3F50E3XG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX250LU3F50E3XG

1SX250LU3F50E3XG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX250LU3F50E3XG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements - 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGFC019R25A2I3E

AGFC019R25A2I3E

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFC019R25A2I3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFC019R25A2I2V

AGFC019R25A2I2V

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFC019R25A2I2V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFD019R25A2I3E

AGFD019R25A2I3E

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFD019R25A2I3E

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFD019R25A2I2V

AGFD019R25A2I2V

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFD019R25A2I2V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFA022R25A3E4X

AGFA022R25A3E4X

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFA022R25A3E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
AGFB022R25A3E4X

AGFB022R25A3E4X

IC FPGA AGILEX-F 2581FBGA

Intel

0 -
AGFB022R25A3E4X

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.2M Logic Elements - 0°C ~ 100°C (TJ) - - -
1SX210HU2F50I2VG

1SX210HU2F50I2VG

IC FPGA STRATIX 10 2397FBGA

Intel

0 -
1SX210HU2F50I2VG

数据表

Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2100K Logic Elements - -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGFA023R31C2E3V

AGFA023R31C2E3V

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFA023R31C2E3V

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户