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图片 厂商料号 库存情况 价格 数量 数据表 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口
S32G233AABK0VUCR

S32G233AABK0VUCR

S32G233A ARM CORTEX-M7 AND -A53

NXP USA Inc.

0 -
S32G233AABK0VUCR

数据表

525-FBGA, FCBGA - Tape & Reel (TR) Obsolete ARM® Cortex®-A53, ARM® Cortex®-M7 1 Core, 64-Bit/2 Core, 32-Bit Multimedia; NEON DDR3L, LPDDR4 No Surface Mount - GbE (4) 400MHz, 1GHz - USB 2.0 OTG (1) ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC 1.2V, 1.8V, 2.5V, 3.3V 525-FCPBGA (19x19) AEC-Q100 -40°C ~ 105°C (TA) Automotive DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
S32G234MSBK1VUCR

S32G234MSBK1VUCR

S32G234M ARM CORTEX-M7, HSE W/PR

NXP USA Inc.

0 -
S32G234MSBK1VUCR

数据表

525-FBGA, FCBGA - Tape & Reel (TR) Active ARM® Cortex®-M7 3 Core, 32/64-Bit Multimedia; NEON - No Surface Mount - 1/2.5Gbps (4) 400MHz - - Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC 1.2V, 1.8V, 2.5V, 3.3V 525-FCPBGA (19x19) AEC-Q100 -40°C ~ 105°C (TA) Automotive DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
S32G234MABK1VUCR

S32G234MABK1VUCR

S32G234M ARM CORTEX-M7, HSE, LLC

NXP USA Inc.

0 -
S32G234MABK1VUCR

数据表

525-FBGA, FCBGA - Tape & Reel (TR) Active ARM® Cortex®-M7 3 Core, 32/64-Bit Multimedia; NEON - No Surface Mount - 1/2.5Gbps (4) 400MHz - - Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC 1.2V, 1.8V, 2.5V, 3.3V 525-FCPBGA (19x19) AEC-Q100 -40°C ~ 105°C (TA) Automotive DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
S32G234MSBK1VUCT

S32G234MSBK1VUCT

S32G234M ARM CORTEX-M7, HSE W/PR

NXP USA Inc.

0 -
S32G234MSBK1VUCT

数据表

525-FBGA, FCBGA - Tray Active ARM® Cortex®-M7 3 Core, 32/64-Bit Multimedia; NEON - No Surface Mount - 1/2.5Gbps (4) 400MHz - - Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC 1.2V, 1.8V, 2.5V, 3.3V 525-FCPBGA (19x19) AEC-Q100 -40°C ~ 105°C (TA) Automotive DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
B30688-D5352-X923

B30688-D5352-X923

MODULES

Qualcomm

0 -
B30688-D5352-X923

数据表

- - Bulk Obsolete - - - - - - - - - - - - - - - - - -
B30688-D5354-X923

B30688-D5354-X923

MODULES

Qualcomm

0 -
B30688-D5354-X923

数据表

- - Bulk Obsolete - - - - - - - - - - - - - - - - - -
R9A06G032PGBG#AC0

R9A06G032PGBG#AC0

R9A06G032PGBG#AC0

Renesas Electronics Corporation

0 -
R9A06G032PGBG#AC0

数据表

400-LFBGA RZ/N1D Bulk Obsolete ARM® Cortex®-A7 2 Core, 32-Bit ARM® Cortex®-M3 DDR2, DDR3 No Surface Mount LCD 10/100/1000Mbps 500MHz - USB 2.0 (2) Boot Security, Secure JTAG 1.5V, 1.8V, 2.5V, 3.3V 400-LFBGA (17x17) - -40°C ~ 110°C (TJ) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9J03G019GBG#AC1

R9J03G019GBG#AC1

R9J03G019GBG#AC1

Renesas Electronics Corporation

0 -
R9J03G019GBG#AC1

数据表

484-BGA - Bulk Obsolete - - - - - Surface Mount - - - - - - - 484-BGA (23x23) - - - -
UPD70F3543M1GKA2-GAK-AX

UPD70F3543M1GKA2-GAK-AX

UPD70F3543M1GKA2-GAK-AX

Renesas Electronics Corporation

0 -
UPD70F3543M1GKA2-GAK-AX

数据表

- - Bulk Obsolete - - - - - - - - - - - - - - - - - -
R9A06G032SGBG#BC0

R9A06G032SGBG#BC0

R9A06G032SGBG#BC0

Renesas Electronics Corporation

0 -
R9A06G032SGBG#BC0

数据表

- - Bulk Obsolete - - - - - - - - - - - - - - - - - -
R9A06G033PGBG#AC0

R9A06G033PGBG#AC0

R9A06G033PGBG#AC0

Renesas Electronics Corporation

0 -
R9A06G033PGBG#AC0

数据表

324-LFBGA RZ/N1S Bulk Obsolete ARM® Cortex®-A7 1 Core, 32-Bit ARM® Cortex®-M3 DDR2, DDR3 No Surface Mount LCD 10/100/1000Mbps 500MHz - USB 2.0 (2) AES, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 1.5V, 1.8V, 2.5V, 3.3V 324-LFBGA (15x15) - -40°C ~ 110°C (TJ) - CANbus, eMMC/SD/SDIO, I2C, SPI, UART
R9J03G019GBG#BC1

R9J03G019GBG#BC1

R9J03G019GBG#BC1

Renesas Electronics Corporation

0 -
R9J03G019GBG#BC1

数据表

484-BGA - Bulk Obsolete - - - - - Surface Mount - - - - - - - 484-BGA (23x23) - - - -
R9A06G033SGBA#BC0

R9A06G033SGBA#BC0

R9A06G033SGBA#BC0

Renesas Electronics Corporation

0 -
R9A06G033SGBA#BC0

数据表

196-LFBGA RZ/N1S Bulk Obsolete ARM® Cortex®-A7 1 Core, 32-Bit ARM® Cortex®-M3 DDR2, DDR3 Yes Surface Mount LCD 10/100/1000Mbps (5) 500MHz - USB 2.0 (2) Secure JTAG 3.3V 196-LFBGA (12x12) - -40°C ~ 110°C (TJ) - CANbus, I2C, SPI, UART
R9A07G017GBG#BC0

R9A07G017GBG#BC0

IC MCU

Renesas Electronics Corporation

0 -
R9A07G017GBG#BC0

数据表

- - Bulk Obsolete - - - - - - - - - - - - - - - - - -
ATSAMA5D29-TA100-CNR

ATSAMA5D29-TA100-CNR

SAMA5D29 TA100 SIP,BGA,EXT TEMP,

Microchip Technology

0 -
ATSAMA5D29-TA100-CNR

数据表

289-LFBGA SAMA5D2 Tape & Reel (TR) Active ARM® Cortex®-A5 1 Core, 32-Bit Multimedia; NEON™ MPE DDR2, DDR3, DDR3L, LPDDR, LPDDR2, LPDDR3 No Surface Mount LCD 10/100Mbps (1) 500MHz - USB (3) AES, ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure Memory, Secure RTC, SHA, TDES, TRNG 1.2V, 1.35V, 1.8V 289-LFBGA (14x14) - -40°C ~ 105°C (TA) - DMA, EBI, I2C, SPI, SSC, UART/USART
PIC64GX1000-V/FCV

PIC64GX1000-V/FCV

64-BIT MPU, RISC-V QUAD-CORE, 4X

Microchip Technology

0 -
PIC64GX1000-V/FCV

数据表

484-BFBGA - Tray Active RV64GC 4 Core, 64-Bit RV64IMAC DDR4, LPDDR4 No Surface Mount HDMI, MIPI-CSI2 10/100/1000Mbps (2) 625MHz - USB 2.0 OTG (1) AES, Boot Security, Cryptography, SHA, TRNG 1.2V, 1.5V, 1.8V, 2.5V, 3.3V 484-FBGA (19x19) - -40°C ~ 100°C (TJ) - CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
PIC64GX1000-C/FCV

PIC64GX1000-C/FCV

64-BIT MPU, RISC-V QUAD-CORE, 4X

Microchip Technology

0 -
PIC64GX1000-C/FCV

数据表

484-BFBGA - Tray Active RV64GC 4 Core, 64-Bit RV64IMAC DDR4, LPDDR4 No Surface Mount HDMI, MIPI-CSI2 10/100/1000Mbps (2) 625MHz - USB 2.0 OTG (1) AES, Boot Security, Cryptography, SHA, TRNG 1.2V, 1.5V, 1.8V, 2.5V, 3.3V 484-FBGA (19x19) - 0°C ~ 100°C (TJ) - CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
PIC64GX1000-C/FCVP

PIC64GX1000-C/FCVP

64-BIT MPU, RISC-V QUAD-CORE, 4X

Microchip Technology

0 -
PIC64GX1000-C/FCVP

数据表

484-BFBGA - Tray Active RV64GC 4 Core, 64-Bit RV64IMAC DDR4, LPDDR4 No Surface Mount HDMI, MIPI-CSI2 10/100/1000Mbps (2) 625MHz - USB 2.0 OTG (1) AES, Boot Security, Cryptography, SHA, TRNG 1.2V, 1.5V, 1.8V, 2.5V, 3.3V 484-FBGA (19x19) - 0°C ~ 100°C (TJ) - CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
PIC64GX1000-V/FCSP

PIC64GX1000-V/FCSP

64-BIT MPU, RISC-V QUAD-CORE, 4X

Microchip Technology

0 -
PIC64GX1000-V/FCSP

数据表

325-TFBGA - Tray Active RV64GC 4 Core, 64-Bit RV64IMAC DDR4, LPDDR4 No Surface Mount HDMI, MIPI-CSI2 10/100/1000Mbps (2) 625MHz - USB 2.0 OTG (1) AES, Boot Security, Cryptography, SHA, TRNG 1.2V, 1.5V, 1.8V, 2.5V, 3.3V 325-CSPBGA (11x11) - -40°C ~ 100°C (TJ) - CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
PIC64GX1000-C/FCSP

PIC64GX1000-C/FCSP

64-BIT MPU, RISC-V QUAD-CORE, 4X

Microchip Technology

0 -
PIC64GX1000-C/FCSP

数据表

325-TFBGA - Tray Active RV64GC 4 Core, 64-Bit RV64IMAC DDR4, LPDDR4 No Surface Mount HDMI, MIPI-CSI2 10/100/1000Mbps (2) 625MHz - USB 2.0 OTG (1) AES, Boot Security, Cryptography, SHA, TRNG 1.2V, 1.5V, 1.8V, 2.5V, 3.3V 325-CSPBGA (11x11) - 0°C ~ 100°C (TJ) - CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART
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