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微处理器

制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口

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图片 厂商料号 库存情况 价格 数量 数据表 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口
STM32MP255FAK3

STM32MP255FAK3

STM32MP255FAK3

STMicroelectronics

0 -
STM32MP255FAK3

数据表

424-VFBGA STM32MP2 Tray Active ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 2, 1, 1 Core, 32-Bit GPU DDR3L, DDR4, LPDDR4 Yes Surface Mount LCD, LVDS, MIPI-CSI2 10/100/1000Mbps (3) 1.5GHz - USB 2.0 (1), USB 3.0 (1), USB Type-C (1) ARM TZ, Boot Security, TRNG 1.8V, 3.3V 424-VFBGA (14x14) - -40°C ~ 125°C (TJ) - GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART
STM32MP257CAK3

STM32MP257CAK3

STM32MP257CAK3

STMicroelectronics

0 -
STM32MP257CAK3

数据表

424-VFBGA STM32MP2 Tray Active ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 2, 1, 1 Core, 32-Bit GPU DDR3L, DDR4, LPDDR4 Yes Surface Mount LCD, LVDS, MIPI-CSI2 10/100/1000Mbps (3) 1.2GHz - USB 2.0 (1), USB 3.0 (1), USB Type-C (1) ARM TZ, Boot Security, TRNG 1.8V, 3.3V 424-VFBGA (14x14) - -40°C ~ 125°C (TJ) - GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART
STA1385ELAS2TR

STA1385ELAS2TR

IC MPU AEC-Q100 600MHZ 361LFBGA

STMicroelectronics

0 -
STA1385ELAS2TR

数据表

361-LFBGA - Tape & Reel (TR) Active ARM® Cortex®-A7 2 Core, 32-Bit ARM® Cortex®-M3, Multimedia; NEON DDR3L, LPDDR2, SRAM No Surface Mount - GBE (2) 600MHz - USB 2.0 + PHY (2) AES, MD5, SHA-1/2, TRNG 3.3V 361-LFBGA (16x16) AEC-Q100 -40°C ~ 150°C (TJ) Automotive CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
STM32MP251AAI3

STM32MP251AAI3

STM32MP251AAI3

STMicroelectronics

0 -
STM32MP251AAI3

数据表

436-TFBGA STM32MP2 Tray Active ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 2, 1, 1 Core, 32-Bit GPU DDR3L, DDR4, LPDDR4 Yes Surface Mount LCD, LVDS, MIPI-CSI2 10/100/1000Mbps (3) 1.2GHz - USB 2.0 (1), USB 3.0 (1), USB Type-C (1) ARM TZ, Boot Security, TRNG 1.8V, 3.3V 436-TFBGA (18x18) - -40°C ~ 125°C (TJ) - GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART
STA1385EOAS2TR

STA1385EOAS2TR

IC MPU AEC-Q100 600MHZ 361LFBGA

STMicroelectronics

0 -
STA1385EOAS2TR

数据表

361-LFBGA - Tape & Reel (TR) Active ARM® Cortex®-A7 2 Core, 32-Bit ARM® Cortex®-M3, Multimedia; NEON DDR3L, LPDDR2, SRAM No Surface Mount - GBE (2) 600MHz - USB 2.0 + PHY (2) AES, MD5, SHA-1/2, TRNG 3.3V 361-LFBGA (16x16) AEC-Q100 -40°C ~ 150°C (TJ) Automotive CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
STA1385EOAS1

STA1385EOAS1

IC MPU AEC-Q100 600MHZ 361LFBGA

STMicroelectronics

0 -
STA1385EOAS1

数据表

361-LFBGA - Bulk Active ARM® Cortex®-A7 2 Core, 32-Bit ARM® Cortex®-M3, Multimedia; NEON DDR3L, LPDDR2, SRAM No Surface Mount - GBE (2) 600MHz - USB 2.0 + PHY (2) AES, MD5, SHA-1/2, TRNG 3.3V 361-LFBGA (16x16) AEC-Q100 -40°C ~ 150°C (TJ) Automotive CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
STA1385EOAS2

STA1385EOAS2

IC MPU AEC-Q100 600MHZ 361LFBGA

STMicroelectronics

0 -
STA1385EOAS2

数据表

361-LFBGA - Bulk Active ARM® Cortex®-A7 2 Core, 32-Bit ARM® Cortex®-M3, Multimedia; NEON DDR3L, LPDDR2, SRAM No Surface Mount - GBE (2) 600MHz - USB 2.0 + PHY (2) AES, MD5, SHA-1/2, TRNG 3.3V 361-LFBGA (16x16) AEC-Q100 -40°C ~ 150°C (TJ) Automotive CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
STA1385ELAS2

STA1385ELAS2

IC MPU AEC-Q100 600MHZ 361LFBGA

STMicroelectronics

0 -
STA1385ELAS2

数据表

361-LFBGA - Bulk Active ARM® Cortex®-A7 2 Core, 32-Bit ARM® Cortex®-M3, Multimedia; NEON DDR3L, LPDDR2, SRAM No Surface Mount - GBE (2) 600MHz - USB 2.0 + PHY (2) AES, MD5, SHA-1/2, TRNG 3.3V 361-LFBGA (16x16) AEC-Q100 -40°C ~ 150°C (TJ) Automotive CAN, FlexRay, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, SSP, UART
STM32MP253AAI3

STM32MP253AAI3

STM32MP253AAI3

STMicroelectronics

0 -
STM32MP253AAI3

数据表

436-TFBGA STM32MP2 Tray Active ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 2, 1, 1 Core, 32-Bit GPU DDR3L, DDR4, LPDDR4 Yes Surface Mount LCD, LVDS, MIPI-CSI2 10/100/1000Mbps (3) 1.2GHz - USB 2.0 (1), USB 3.0 (1), USB Type-C (1) ARM TZ, Boot Security, TRNG 1.8V, 3.3V 436-TFBGA (18x18) - -40°C ~ 125°C (TJ) - GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART
STM32MP251DAI3

STM32MP251DAI3

STM32MP251DAI3

STMicroelectronics

0 -
STM32MP251DAI3

数据表

436-TFBGA STM32MP2 Tray Active ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 2, 1, 1 Core, 32-Bit GPU DDR3L, DDR4, LPDDR4 Yes Surface Mount LCD, LVDS, MIPI-CSI2 10/100/1000Mbps (3) 1.5GHz - USB 2.0 (1), USB 3.0 (1), USB Type-C (1) ARM TZ, Boot Security, TRNG 1.8V, 3.3V 436-TFBGA (18x18) - -40°C ~ 125°C (TJ) - GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART
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