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微处理器

制造商 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口

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图片 厂商料号 库存情况 价格 数量 数据表 封装/外壳 系列 包装 产品状态 核心处理器 核心数量/总线宽度 协处理器/DSP RAM 控制器 图形加速 安装类型 显示和接口控制器 以太网 速度 SATA USB 安全特性 电压 - I/O 供应商设备封装 认证 工作温度 等级 附加接口
IDT79RV4700-133DP

IDT79RV4700-133DP

IC MPU 133MHZ 208QFP

Renesas Electronics Corporation

0 -
IDT79RV4700-133DP

数据表

208-BFQFP Exposed Pad - Tray Obsolete MIPS-I 1 Core, 64-Bit System Control; CP0 - No Surface Mount - - 133MHz - - - 3.3V 208-PQFP (28x28) - 0°C ~ 85°C (TC) - -
R8A774A3HA01BG#U7

R8A774A3HA01BG#U7

SOC RZ/G2M HDMI ON (BULK)

Renesas Electronics Corporation

0 -
R8A774A3HA01BG#U7

数据表

- - Tray Active - - - - - - - - - - - - - - - - - -
R8A774A1HA01BG#U2

R8A774A1HA01BG#U2

IC MCU 32BIT ARM 1022FPBGA

Renesas Electronics Corporation

0 -
R8A774A1HA01BG#U2

数据表

- - Tray Active - - - - - - - - - - - - - - - - - -
R8A774A3HA01BG#UV

R8A774A3HA01BG#UV

SOC RZ/G2M HDMI ON (BULK)

Renesas Electronics Corporation

0 -
R8A774A3HA01BG#UV

数据表

1022-BFBGA, FCBGA RZ/G2M Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 4, 2 Core, 64-Bit ARM® Cortex®-R7 LPDDR4 Yes Surface Mount HMI 10/100/1000Mbps (1) 1.2GHz, 1.5GHz - USB 2.0 OTG (2), USB 3.0 (1) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 3.3V 1022-FCBGA (29x29) - -40°C ~ 85°C - CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
R8A774E1HA01BN#G0

R8A774E1HA01BN#G0

IC MCU 32BIT ARM 1022FPBGA

Renesas Electronics Corporation

0 -
R8A774E1HA01BN#G0

数据表

- - Tray Active - - - - - - - - - - - - - - - - - -
R8A774E1HA01BN#G6

R8A774E1HA01BN#G6

SOC RZ/G2H HDMI ON (FULL)

Renesas Electronics Corporation

0 -
R8A774E1HA01BN#G6

数据表

1022-BFBGA, FCBGA RZ/G2H Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 4, 4 Core, 64-Bit ARM® Cortex®-R7 LPDDR4 Yes Surface Mount LVDS, MIPI-CSI 10/100Mbps (1) 1.2GHz, 1.5GHz SATA 16Gbps (1) USB 2.0 OTG (2), USB 3.0 (1) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 3.3V 1022-FCBGA (29x29) - -40°C ~ 85°C - CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
R8A774E1HA01BN#U6

R8A774E1HA01BN#U6

SOC RZ/G2H HDMI ON (BULK)

Renesas Electronics Corporation

0 -
R8A774E1HA01BN#U6

数据表

1022-BFBGA, FCBGA RZ/G2H Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 4, 4 Core, 64-Bit ARM® Cortex®-R7 LPDDR4 Yes Surface Mount LVDS, MIPI-CSI 10/100Mbps (1) 1.2GHz, 1.5GHz SATA 16Gbps (1) USB 2.0 OTG (2), USB 3.0 (1) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 3.3V 1022-FCBGA (29x29) - -40°C ~ 85°C - CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
R8A774E0HA01BN#YBC

R8A774E0HA01BN#YBC

SOC RZ/G2H HDMI OFF (CS)

Renesas Electronics Corporation

0 -
R8A774E0HA01BN#YBC

数据表

1022-BFBGA, FCBGA RZ/G2E Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 4, 4 Core, 64-Bit - LPDDR4 Yes Surface Mount DU 10/100Mbps (1) 1.2GHz, 1.5GHz - USB 2.0 OTG (2), USB 3.0 (1) AES, ARM TZ, Hash, RSA, Secure Boot, TRNG 3.3V 1022-FCBGA (29x29) - -40°C ~ 85°C - CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
R8A774E0HA01BN#YJC

R8A774E0HA01BN#YJC

SOC RZ/G2H HDMI OFF (WS)

Renesas Electronics Corporation

0 -
R8A774E0HA01BN#YJC

数据表

1022-BFBGA, FCBGA RZ/G2E Tray Active ARM® Cortex®-A53, ARM® Cortex®-A57 4, 4 Core, 64-Bit - LPDDR4 Yes Surface Mount DU 10/100Mbps (1) 1.2GHz, 1.5GHz - USB 2.0 OTG (2), USB 3.0 (1) - 3.3V 1022-FCBGA (29x29) - -40°C ~ 85°C - CANbus, DMA, I2C, I2S, MMC/SD/SDIO, PCI, SPI, UART
IDT79RV4700-175GH

IDT79RV4700-175GH

IC MPU 175MHZ 179PGA

Renesas Electronics Corporation

0 -
IDT79RV4700-175GH

数据表

179-PGA - Tube Obsolete MIPS-I 1 Core, 64-Bit System Control; CP0 - No Through Hole - - 175MHz - - - 3.3V 179-PGA - 0°C ~ 85°C (TC) - -
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