| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 核心处理器 | 核心数量/总线宽度 | 协处理器/DSP | RAM 控制器 | 图形加速 | 安装类型 | 显示和接口控制器 | 以太网 | 速度 | SATA | USB | 安全特性 | 电压 - I/O | 供应商设备封装 | 认证 | 工作温度 | 等级 | 附加接口 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PIC64GX1000-C/FCS64-BIT MPU, RISC-V QUAD-CORE, 4X Microchip Technology |
5 | - |
|
数据表 |
325-TFBGA | - | Tray | Active | RV64GC | 4 Core, 64-Bit | RV64IMAC | DDR4, LPDDR4 | No | Surface Mount | HDMI, MIPI-CSI2 | 10/100/1000Mbps (2) | 625MHz | - | USB 2.0 OTG (1) | AES, Boot Security, Cryptography, SHA, TRNG | 1.2V, 1.5V, 1.8V, 2.5V, 3.3V | 325-CSPBGA (11x11) | - | 0°C ~ 100°C (TJ) | - | CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART |
|
PIC64GX1000-V/FCS64-BIT MPU, RISC-V QUAD-CORE, 4X Microchip Technology |
5 | - |
|
数据表 |
325-TFBGA | - | Tray | Active | RV64GC | 4 Core, 64-Bit | RV64IMAC | DDR4, LPDDR4 | No | Surface Mount | HDMI, MIPI-CSI2 | 10/100/1000Mbps (2) | 625MHz | - | USB 2.0 OTG (1) | AES, Boot Security, Cryptography, SHA, TRNG | 1.2V, 1.5V, 1.8V, 2.5V, 3.3V | 325-CSPBGA (11x11) | - | -40°C ~ 100°C (TJ) | - | CANbus, DMA, GPIO, I2C, MMC/SD, PCIe, QSPI, SPI, UART/USART |
|
TSPC603RVGU8LCIC MPU 200MHZ 255CBGA Microchip Technology |
0 | - |
|
数据表 |
255-BCBGA Exposed Pad | - | Tray | Obsolete | PowerPC 603e | 1 Core, 32-Bit | - | - | No | Surface Mount | - | - | 200MHz | - | - | - | 3.3V | 255-CBGA (21x21) | - | -40°C ~ 110°C (TC) | - | - |
|
RM7065C-600G-D004IC MPU 600MHZ Microchip Technology |
0 | - |
|
数据表 |
- | - | Tray | Active | - | 1 Core, 64-Bit | - | DDR, SDRAM | - | - | - | - | 600MHz | - | - | - | 2.5V, 3.3V | - | - | - | - | PCI |
|
TSPC603RVGU10LCIC MPU 233MHZ 255CBGA Microchip Technology |
0 | - |
|
数据表 |
255-BCBGA Exposed Pad | - | Tray | Obsolete | PowerPC 603e | 1 Core, 32-Bit | - | - | No | Surface Mount | - | - | 233MHz | - | - | - | 3.3V | 255-CBGA (21x21) | - | -40°C ~ 110°C (TC) | - | - |
|
PCX8240VTPU200EIC MPU 200MHZ 352TBGA Microchip Technology |
0 | - |
|
数据表 |
352-LBGA | - | Tray | Obsolete | PowerPC 603e | 1 Core, 32-Bit | - | DRAM, SDRAM | No | Surface Mount | - | - | 200MHz | - | - | - | 3.3V | 352-TBGA (35x35) | - | -40°C ~ 110°C (TJ) | - | I2C, I²O, PCI |
|
TSXPC860SRVZQU66DIC MPU 66MHZ 357BGA Microchip Technology |
0 | - |
|
数据表 |
357-BBGA | - | Tray | Obsolete | PowerPC | 1 Core, 32-Bit | Communications; CPM | DRAM | No | Surface Mount | - | 10/100Mbps (1) | 66MHz | - | - | - | 3.3V | 357-PBGA (25x25) | - | -40°C ~ 110°C (TC) | - | I2C, PCMCIA, SCC, SMC, SPI, UART |
|
TSPC603RVGU12LCIC MPU 266MHZ 255CBGA Microchip Technology |
0 | - |
|
数据表 |
255-BCBGA Exposed Pad | - | Tray | Obsolete | PowerPC 603e | 1 Core, 32-Bit | - | - | No | Surface Mount | - | - | 266MHz | - | - | - | 3.3V | 255-CBGA (21x21) | - | -40°C ~ 110°C (TC) | - | - |
|
TS68C000VC8AIC MPU 8MHZ 64DIL Microchip Technology |
0 | - |
|
数据表 |
64-CDIP (0.900", 22.86mm) | - | Tube | Obsolete | 68000 | 1 Core, 16/32-Bit | - | - | No | Through Hole | - | - | 8MHz | - | - | - | 5.0V | 64-DIL | - | -40°C ~ 85°C (TC) | - | - |
|
TS68C000VC10AIC MPU 10MHZ 64DIL Microchip Technology |
0 | - |
|
数据表 |
64-CDIP (0.900", 22.86mm) | - | Tube | Obsolete | 68000 | 1 Core, 16/32-Bit | - | - | No | Through Hole | - | - | 10MHz | - | - | - | 5.0V | 64-DIL | - | -40°C ~ 85°C (TC) | - | - |