| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MKL16Z256VMP4IC MCU 32BIT 256KB FLSH 64MAPBGA NXP USA Inc. |
640 | - |
|
数据表 |
64-LFBGA | Kinetis KL1 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | - | 54 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 32K x 8 | - | Internal | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Surface Mount | |
|
S9S08AW32E5CFGEIC MCU 8BIT 32KB FLASH 44LQFP NXP USA Inc. |
0 | - |
|
数据表 |
44-LQFP | S08 | Tray | Active | Not Verified | S08 | 40MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 34 | 32KB (32K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
S9S12VR64F2CLCIC MCU 16BIT 64KB FLASH 32LQFP NXP USA Inc. |
0 | - |
|
数据表 |
32-LQFP | S12 MagniV | Tray | Obsolete | Not Verified | 12V1 | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 16 | 64KB (64K x 8) | 16-Bit | FLASH | 512 x 8 | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 3.13V ~ 5.5V | A/D 2x10b | Surface Mount | |
|
MC9S08SL8MTJIC MCU 8BIT 8KB FLASH 20TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
20-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 16 | 8KB (8K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 125°C (TA) | 512 x 8 | - | External | 2.7V ~ 5.5V | A/D 12x10b | Surface Mount | |
|
MC9S08PA4AVTJIC MCU 8BIT 4KB FLASH 20TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
20-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 4 | 4KB (4K x 8) | 8-Bit | FLASH | 128 x 8 | -40°C ~ 105°C (TA) | 512 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 4x10b | Surface Mount | |
|
MKL33Z128VMP4IC MCU 32BIT 128KB FLSH 64MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
64-LFBGA | Kinetis KL3 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, SPI, UART/USART | DMA, I2S, LCD, LVD, POR, PWM, WDT | - | 54 | 128KB (128K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 16K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Surface Mount | |
|
MC68HC908AP8CFBIC MCU 8BIT 8KB FLASH 44QFP NXP USA Inc. |
0 | - |
|
数据表 |
44-QFP | HC08 | Tray | Obsolete | Not Verified | HC08 | 8MHz | I2C, IRSCI, SCI, SPI | LED, LVD, POR, PWM | - | 32 | 8KB (8K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 1K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
S9S08EL32F1MTJRIC MCU 8BIT 32KB FLASH 20TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
20-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 16 | 32KB (32K x 8) | 8-Bit | FLASH | 512 x 8 | -40°C ~ 125°C (TA) | 1K x 8 | - | External | 2.7V ~ 5.5V | A/D 12x10b | Surface Mount | |
|
S9S08EL32F1VTLRIC MCU 8BIT 32KB FLASH 28TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
28-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 22 | 32KB (32K x 8) | 8-Bit | FLASH | 512 x 8 | -40°C ~ 105°C (TA) | 1K x 8 | - | External | 2.7V ~ 5.5V | A/D 16x10b | Surface Mount | |
|
MC9S12XS64CAERIC MCU 16BIT 64KB FLASH 64LQFP NXP USA Inc. |
0 | - |
|
数据表 |
64-LQFP | HCS12X | Tape & Reel (TR) | Obsolete | Not Verified | HCS12X | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | - | 44 | 64KB (64K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 4K x 8 | - | External | 1.72V ~ 5.5V | A/D 8x12b | Surface Mount |