| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MCF5470VR200IC MCU 32BIT ROMLESS 388PBGA NXP USA Inc. |
0 | - |
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数据表 |
388-BBGA | MCF547x | Tray | Not For New Designs | Not Verified | Coldfire V4E | 200MHz | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | DMA, PWM, WDT | - | 99 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C (TA) | 32K x 8 | - | External | 1.43V ~ 1.58V | - | Surface Mount | |
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SCF5235F4CVM150IC MCU 32BIT ROMLESS 256MAPBGA NXP USA Inc. |
0 | - |
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数据表 |
256-LBGA | MCF523x | Bulk | Not For New Designs | Not Verified | Coldfire V2 | 150MHz | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, WDT | - | 97 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 64K x 8 | - | External | 1.4V ~ 1.6V | - | Surface Mount | |
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MCF5407CFT162IC MCU 32BIT ROMLESS 208FQFP NXP USA Inc. |
0 | - |
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数据表 |
208-BFQFP | MCF540x | Tray | Obsolete | Not Verified | Coldfire V4 | 162MHz | EBI/EMI, I2C, UART/USART | DMA, WDT | - | 16 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 4K x 8 | - | External | 1.65V ~ 3.6V | - | Surface Mount | |
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MCF5407FT220IC MCU 32BIT ROMLESS 208FQFP NXP USA Inc. |
0 | - |
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数据表 |
208-BFQFP | MCF540x | Tray | Obsolete | Not Verified | Coldfire V4 | 220MHz | EBI/EMI, I2C, UART/USART | DMA, WDT | - | 16 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C (TA) | 4K x 8 | - | External | 1.65V ~ 3.6V | - | Surface Mount | |
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MC56F8366MFVEIC MCU 16BIT 512KB FLASH 144LQFP NXP USA Inc. |
0 | - |
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数据表 |
144-LQFP | 56F8xxx | Tray | Active | Not Verified | 56800E | 60MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, Temp Sensor, WDT | - | 62 | 512KB (256K x 16) | 16-Bit | FLASH | - | -40°C ~ 125°C (TA) | 18K x 16 | - | External | 2.25V ~ 3.6V | A/D 16x12b | Surface Mount | |
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SPC5644AF0MMG2RIC MCU 32BIT 4MB FLASH 208MAPBGA NXP USA Inc. |
0 | - |
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数据表 |
208-BGA | MPC56xx Qorivva | Tape & Reel (TR) | Active | Not Verified | e200z4 | 120MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | - | 120 | 4MB (4M x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 125°C (TA) | 192K x 8 | - | Internal | 1.14V ~ 5.25V | A/D 40x12b | Surface Mount | |
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SPC5777CSK3MME4RPOWER ARCH CORES, 8MB FLASH, 300 NXP USA Inc. |
0 | - |
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数据表 |
416-BGA | MPC57xx | Tape & Reel (TR) | Active | - | e200z7 | 300MHz | CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI | DMA, LVD, POR, Zipwire | Automotive | - | 8MB (8M x 8) | 32-Bit Tri-Core | FLASH | - | -40°C ~ 125°C (TA) | 512K x 8 | AEC-Q100 | External, Internal | 3V ~ 3.6V, 4.5V ~ 5.5V | A/D 10x16b Sigma-Delta, eQADC | Surface Mount | |
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SPC5777CDK3MME4RIC MCU 32BIT 8MB FLASH 416MAPBGA NXP USA Inc. |
0 | - |
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数据表 |
416-BGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z7 | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | - | - | 8MB (8M x 8) | 32-Bit Tri-Core | FLASH | - | -40°C ~ 125°C (TA) | 512K x 8 | - | Internal | 3V ~ 5.5V | A/D 16b Sigma-Delta, eQADC | Surface Mount | |
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MC56F8365MFGEIC MCU 16BIT 512KB FLASH 128LQFP NXP USA Inc. |
0 | - |
|
数据表 |
128-LQFP | 56F8xxx | Tray | Obsolete | Not Verified | 56800E | 60MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, Temp Sensor, WDT | - | 49 | 512KB (256K x 16) | 16-Bit | FLASH | - | -40°C ~ 125°C (TA) | 18K x 16 | - | External | 2.25V ~ 3.6V | A/D 16x12b | Surface Mount | |
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MPC5553MZP132IC MCU 32BIT 1.5MB FLASH 416PBGA NXP USA Inc. |
0 | - |
|
数据表 |
416-BBGA | MPC55xx Qorivva | Tray | Active | Not Verified | e200z6 | 132MHz | CANbus, EBI/EMI, Ethernet, SCI, SPI | DMA, POR, PWM, WDT | - | 220 | 1.5MB (1.5M x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 125°C (TA) | 64K x 8 | - | External | 1.35V ~ 1.65V | A/D 40x12b | Surface Mount |