| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
S912XDP512J1CAARIC MCU 16BIT 512KB FLASH 80QFP NXP USA Inc. |
0 | - |
|
数据表 |
80-QFP | HCS12X | Tape & Reel (TR) | Last Time Buy | Not Verified | HCS12X | 80MHz | CANbus, I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 59 | 512KB (512K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 32K x 8 | - | External | 2.35V ~ 5.5V | A/D 8x10b, 16x10b | Surface Mount | |
|
SPC5747CK1VMJ6RIC MCU 32BIT 4MB FLSH 256MAPPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z2, e200z4 | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 178 | 4MB (4M x 8) | 32-Bit Dual-Core | FLASH | - | -40°C ~ 105°C (TA) | 512K x 8 | - | Internal | 3V ~ 5.5V | A/D 80x10b, 64x12b | Surface Mount | |
|
SPC5746CBK1AMMJ6IC MCU 32BIT 3MB FLSH 256MAPPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | MPC57xx | Tray | Active | Not Verified | e200z2, e200z4 | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 178 | 3MB (3M x 8) | 32-Bit Dual-Core | FLASH | - | -40°C ~ 125°C (TA) | 512K x 8 | - | Internal | 3V ~ 5.5V | A/D 80x10b, 64x12b | Surface Mount | |
|
FS32R294JCK0MJDTIC MCU 32BIT 269LFBGA NXP USA Inc. |
0 | - |
|
数据表 |
269-LFBGA | S32R | Tray | Active | - | e200z4, e200z7 | - | CANbus, Ethernet, FlexRay, QSPI, SPI | Temp Sensor | - | - | - | 32-Bit Dual-Core | ROMless | - | - | 5.5M x 8 | - | - | - | - | Surface Mount | |
|
FS32R294JAK0MJDTIC MCU NXP USA Inc. |
0 | - |
|
数据表 |
269-LFBGA | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Surface Mount | |
|
SPC5747CK1VMJ6IC MCU 32BIT 4MB FLSH 256MAPPBGA NXP USA Inc. |
0 | - |
|
数据表 |
256-LBGA | MPC57xx | Bulk | Active | Not Verified | e200z2, e200z4 | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | - | 178 | 4MB (4M x 8) | 32-Bit Dual-Core | FLASH | - | -40°C ~ 105°C (TA) | 512K x 8 | - | Internal | 3V ~ 5.5V | A/D 80x10b, 64x12b | Surface Mount | |
|
S9S12DT12F1MPVEIC MCU 16BIT 128KB FLASH 112LQFP NXP USA Inc. |
0 | - |
|
数据表 |
112-LQFP | HCS12 | Bulk | Last Time Buy | Not Verified | HCS12 | 25MHz | CANbus, I2C, SCI, SPI | PWM, WDT | - | 91 | 128KB (128K x 8) | 16-Bit | FLASH | 2K x 8 | -40°C ~ 125°C (TA) | 8K x 8 | - | Internal | 2.35V ~ 5.25V | A/D 16x10b | Surface Mount | |
|
MCF5274LVF166IC MCU 32BIT ROMLESS 196MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
196-LBGA | MCF527x | Tray | Not For New Designs | Not Verified | Coldfire V2 | 166MHz | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | DMA, WDT | - | 61 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C | 64K x 8 | - | External | 1.4V ~ 1.6V | - | Surface Mount | |
|
MC9S12XA512CAAIC MCU 16BIT 512KB FLASH 80QFP NXP USA Inc. |
0 | - |
|
数据表 |
80-QFP | HCS12X | Tray | Active | Not Verified | HCS12X | 80MHz | EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 59 | 512KB (512K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 32K x 8 | - | External | 2.35V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
MCF53721CVM240IC MCU 32BIT ROMLESS 196MAPBGA NXP USA Inc. |
0 | - |
|
数据表 |
196-LBGA | MCF537x | Tray | Not For New Designs | Not Verified | Coldfire V3 | 240MHz | EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | DMA, POR, PWM, WDT | - | 62 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 32K x 8 | - | External | 1.4V ~ 3.6V | - | Surface Mount |