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微控制器
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC9S08PL60CLCIC MCU 8BIT 32KB FLASH 32LQFP NXP USA Inc. |
0 | - |
|
数据表 |
32-LQFP | S08 | Bulk | Active | Not Verified | S08 | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | - | 30 | 32KB (32K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 85°C (TA) | 4K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 12x10b | Surface Mount | |
|
MIMXRT1062CVL5BRIC MCU 32BIT 128MB ROM 196LFBGA NXP USA Inc. |
300 | - |
|
数据表 |
196-LFBGA | RT1060 | Tape & Reel (TR) | Active | - | ARM® Cortex®-M7 | 528MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | 127 | 128KB (128K x 8) | 32-Bit | ROM | - | -40°C ~ 105°C (TJ) | 1M x 8 | - | External, Internal | 1.15V ~ 1.26V, 3V ~ 3.6V | A/D 20x12b | Surface Mount | |
|
MK22FN512VDC12IC MCU 32BIT 512KB FLSH 121XFBGA NXP USA Inc. |
1,740 | - |
|
数据表 |
121-XFBGA | Kinetis K20 | Tray | Active | Not Verified | ARM® Cortex®-M4 | 120MHz | I2C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I2S, LVD, POR, PWM, WDT | - | 81 | 512KB (512K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 128K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Surface Mount | |
|
MC9S08PA16VWJIC MCU 8BIT 16KB FLASH 20SOIC NXP USA Inc. |
952 | - |
|
数据表 |
20-SOIC (0.295", 7.50mm Width) | S08 | Bulk | Active | Not Verified | S08 | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 18 | 16KB (16K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 12x12b | Surface Mount | |
|
|
MC9S08FL8CLCRIC MCU 8BIT 8KB FLASH 32LQFP NXP USA Inc. |
0 | - |
|
数据表 |
32-LQFP | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 20MHz | SCI | LVD, PWM, WDT | - | 30 | 8KB (8K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 768 x 8 | - | Internal | 4.5V ~ 5.5V | A/D 12x8b | Surface Mount | |
|
LPC1111JHN33/203EIC MCU 32BIT 8KB FLASH 32HVQFN NXP USA Inc. |
0 | - |
|
数据表 |
32-VQFN Exposed Pad | LPC1100XL | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 28 | 8KB (8K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
MC908QY4ACDWEIC MCU 8BIT 4KB FLASH 16SOIC NXP USA Inc. |
1,878 | - |
|
数据表 |
16-SOIC (0.295", 7.50mm Width) | HC08 | Tube | Not For New Designs | Verified | HC08 | 8MHz | - | LVD, POR, PWM | - | 13 | 4KB (4K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 128 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 6x10b | Surface Mount | |
|
MC9RS08KA1CPCIC MCU 8BIT 1KB FLASH 8DIP NXP USA Inc. |
269 | - |
|
数据表 |
8-DIP (0.300", 7.62mm) | RS08 | Tube | Obsolete | Not Verified | RS08 | 10MHz | - | LVD, POR, WDT | - | 4 | 1KB (1K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 63 x 8 | - | Internal | 1.8V ~ 5.5V | - | Through Hole | |
|
LPC1768FET100,551IC MCU 32BIT 512KB FLSH 100TFBGA NXP USA Inc. |
1,472 | - |
|
数据表 |
100-TFBGA | LPC17xx | Tray | Active | Not Verified | ARM® Cortex®-M3 | 100MHz | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | - | 70 | 512KB (512K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 64K x 8 | - | Internal | 2.4V ~ 3.6V | A/D 8x12b; D/A 1x10b | Surface Mount | |
|
LPC11U24FBD64/401,IC MCU 32BIT 32KB FLASH 64LQFP NXP USA Inc. |
327 | - |
|
数据表 |
64-LQFP | LPC11Uxx | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | - | 54 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 10K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount |
