| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MKL36Z128VLL4IC MCU 32BIT 128KB FLASH 100LQFP NXP USA Inc. |
0 | - |
|
数据表 |
100-LQFP | Kinetis KL3 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT | - | 84 | 128KB (128K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 16K x 8 | - | Internal | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Surface Mount | |
|
S912ZVM16F1MKHRIC MCU 16BIT 16KB FLASH 64LQFP NXP USA Inc. |
0 | - |
|
数据表 |
64-LQFP Exposed Pad | S12 MagniV | Tape & Reel (TR) | Active | Not Verified | S12Z | 50MHz | SCI, SPI | DMA, POR, WDT | - | 31 | 16KB (16K x 8) | 16-Bit | FLASH | 128 x 8 | -40°C ~ 125°C (TA) | 2K x 8 | - | Internal | 3.5V ~ 40V | A/D 9x12b | Surface Mount | |
|
MCHRC705KJ1CPEIC MCU 8BIT 1.2KB OTP 16DIP NXP USA Inc. |
0 | - |
|
数据表 |
16-DIP (0.300", 7.62mm) | HC05 | Tube | Obsolete | Not Verified | HC05 | 4MHz | - | POR, WDT | - | 10 | 1.2KB (1.2K x 8) | 8-Bit | OTP | - | -40°C ~ 85°C (TA) | 64 x 8 | - | Internal | 3V ~ 5.5V | - | Through Hole | |
|
MCF51AG128CLKIC MCU 32BIT 128KB FLASH 80LQFP NXP USA Inc. |
0 | - |
|
数据表 |
80-LQFP | MCF51AG | Bulk | Active | Not Verified | Coldfire V1 | 50MHz | I2C, SCI, SPI | DMA, LVD, PWM, WDT | - | 69 | 128KB (128K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 16K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 24x12b | Surface Mount | |
|
MCF51QE96CLHIC MCU 32BIT 96KB FLASH 64LQFP NXP USA Inc. |
0 | - |
|
数据表 |
64-LQFP | MCF51QE | Bulk | Active | Not Verified | Coldfire V1 | 50MHz | I2C, SCI, SPI | LVD, PWM, WDT | - | 54 | 96KB (96K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 20x12b | Surface Mount | |
|
MKL16Z32VFM4IC MCU 32BIT 32KB FLASH 32QFN NXP USA Inc. |
2,440 | - |
|
数据表 |
32-VFQFN Exposed Pad | Kinetis KL1 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | - | 28 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 4K x 8 | - | Internal | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Surface Mount, Wettable Flank | |
|
S9S08DZ16F2MLCIC MCU 8BIT 16KB FLASH 32LQFP NXP USA Inc. |
0 | - |
|
数据表 |
32-LQFP | S08 | Tray | Active | Not Verified | S08 | 40MHz | CANbus, I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 25 | 16KB (16K x 8) | 8-Bit | FLASH | 512 x 8 | -40°C ~ 125°C (TA) | 1K x 8 | - | External | 2.7V ~ 5.5V | A/D 10x12b | Surface Mount | |
|
PC9S08AC128CFGEIC MCU 8BIT 128KB FLASH 44LQFP NXP USA Inc. |
0 | - |
|
数据表 |
44-LQFP | S08 | Tray | Obsolete | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 38 | 128KB (128K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
MKE02Z16VLC4IC MCU 32BIT 16KB FLASH 32LQFP NXP USA Inc. |
870 | - |
|
数据表 |
32-LQFP | Kinetis KE02 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 40MHz | I2C, SPI, UART/USART | LVD, PWM, WDT | - | 28 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Surface Mount | |
|
S9KEAZN64ACLCIC MCU 32BIT 64KB FLASH 32LQFP NXP USA Inc. |
2,160 | - |
|
数据表 |
32-LQFP | Kinetis KEA | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 40MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 28 | 64KB (64K x 8) | 32-Bit Single-Core | FLASH | 256 x 8 | -40°C ~ 85°C (TA) | 4K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b | Surface Mount |