| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
S9KEAZN8AVTGRIC MCU 32BIT 8KB FLASH 16TSSOP NXP USA Inc. |
5,000 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | Kinetis KEA | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 14 | 8KB (8K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 1K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 12x12b | Surface Mount | |
|
MKL17Z256CAL4RIC MCU 32BIT 256KB FLASH 36WLCSP NXP USA Inc. |
0 | - |
|
数据表 |
36-UFBGA, WLCSP | Kinetis KL1 | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | - | 26 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 32K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 7x16b; D/A 1x12b | Surface Mount | |
|
MCF51JM32VLKIC MCU 32BIT 32KB FLASH 80LQFP NXP USA Inc. |
0 | - |
|
数据表 |
80-LQFP | MCF51JM | Tray | Active | Not Verified | Coldfire V1 | 50MHz | CANbus, I2C, SCI, SPI, USB OTG | LVD, PWM, WDT | - | 66 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 16K x 8 | - | External | 2.7V ~ 5.5V | A/D 12x12b | Surface Mount | |
|
MIMXRT106SDVL6AIC MCU 32BIT ROMLESS 196LFBGA NXP USA Inc. |
0 | - |
|
数据表 |
196-LFBGA | RT1060 | Tray | Discontinued at Digi-Key | Not Verified | ARM® Cortex®-M7 | 600MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | 127 | - | 32-Bit Single-Core | External Program Memory | - | 0°C ~ 95°C (TJ) | 1M x 8 | - | External, Internal | 3V ~ 3.6V | A/D 20x12b | Surface Mount | |
|
C9KEAZN32AMLCRC9KEAZN32AMLCR NXP USA Inc. |
0 | - |
|
数据表 |
32-LQFP | Kinetis KEA | Bulk | Active | - | ARM® Cortex®-M0+ | 40MHz | I2C, SPI, UART/USART | LVD, PMC, PWM, WDT | - | 57 | 32KB (32K x 8) | 32-Bit | FLASH | 256K x 8 | -40°C ~ 125°C (TA) | 4K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b SAR | Surface Mount | |
|
S9KEAZN32BMLCRIC MCU NXP USA Inc. |
0 | - |
|
数据表 |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
S9S12GN32ACLFIC MCU 16BIT 32KB FLASH 48LQFP NXP USA Inc. |
0 | - |
|
数据表 |
48-LQFP | HCS12 | Tray | Active | Not Verified | 12V1 | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 40 | 32KB (32K x 8) | 16-Bit | FLASH | 1K x 8 | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 3.13V ~ 5.5V | A/D 8x10b | Surface Mount | |
|
S9S12P64J0CLHIC MCU 16BIT 64KB FLASH 64LQFP NXP USA Inc. |
0 | - |
|
数据表 |
64-LQFP | HCS12 | Tray | Active | Not Verified | HCS12 | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | - | 49 | 64KB (64K x 8) | 16-Bit | FLASH | 4K x 8 | -40°C ~ 85°C (TA) | 4K x 8 | - | Internal | 1.72V ~ 5.5V | A/D 10x12b | Surface Mount | |
|
MKE12Z512VLL9IC MCU NXP USA Inc. |
0 | - |
|
数据表 |
- | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
MKL03Z16VFG4IC MCU 32BIT 16KB FLASH 16QFN NXP USA Inc. |
950 | - |
|
数据表 |
16-UFQFN Exposed Pad | Kinetis KL03 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | - | 14 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 7x12b | Surface Mount |