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微控制器
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
LPC1112FHI33/102,5IC MCU 32BIT 16KB FLASH 32HVQFN NXP USA Inc. |
0 | - |
|
数据表 |
32-VFQFN Exposed Pad | LPC1100L | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 28 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
MKV42F64VLH16IC MCU 32BIT 64KB FLASH 64LQFP NXP USA Inc. |
0 | - |
|
数据表 |
64-LQFP | Kinetis KV | Tray | Active | Not Verified | ARM® Cortex®-M4 | 168MHz | CANbus, I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | - | 48 | 64KB (64K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 16K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 29x12b | Surface Mount | |
|
S9S08SG32E1VTLRIC MCU 8BIT 32KB FLASH 28TSSOP NXP USA Inc. |
2,500 | - |
|
数据表 |
28-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 22 | 32KB (32K x 8) | 8-Bit | FLASH | - | -40°C ~ 105°C (TA) | 1K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x10b | Surface Mount | |
|
MK12DX256VLF5IC MCU 32BIT 256KB FLASH 48LQFP NXP USA Inc. |
0 | - |
|
数据表 |
48-LQFP | Kinetis K10 | Tray | Active | Not Verified | ARM® Cortex®-M4 | 50MHz | I2C, IrDA, SPI, UART/USART | DMA, I2S, LVD, POR, PWM, WDT | - | 33 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | 4K x 8 | -40°C ~ 105°C (TA) | 32K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 18x16b | Surface Mount | |
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|
S9S08SG32E1CTJRIC MCU 8BIT 32KB FLASH 20TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
20-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 16 | 32KB (32K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 1K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 12x10b | Surface Mount | |
|
MCF51JM32VLDIC MCU 32BIT 32KB FLASH 44LQFP NXP USA Inc. |
0 | - |
|
数据表 |
44-LQFP | MCF51JM | Tray | Active | Not Verified | Coldfire V1 | 50MHz | I2C, SCI, SPI, USB OTG | LVD, PWM, WDT | - | 33 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 16K x 8 | - | External | 2.7V ~ 5.5V | A/D 8x12b | Surface Mount | |
|
MC9S08AC32CFUEIC MCU 8BIT 32KB FLASH 64QFP NXP USA Inc. |
4,525 | - |
|
数据表 |
64-QFP | HCS08 | Tray | Active | Not Verified | HCS08 | 40MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 54 | 32KB (32K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x10b SAR | Surface Mount | |
|
MC9S08QE64CFTIC MCU 8BIT 64KB FLASH 48QFN NXP USA Inc. |
0 | - |
|
数据表 |
48-VFQFN Exposed Pad | S08 | Tray | Active | Not Verified | S08 | 50MHz | I2C, LINbus, SCI, SPI | LVD, PWM, WDT | - | 38 | 64KB (64K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 4K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 10x12b | Surface Mount | |
|
S912ZVM16F1MKFRIC MCU 16BIT 16KB FLASH 48LQFP NXP USA Inc. |
0 | - |
|
数据表 |
48-LQFP Exposed Pad | S12 MagniV | Tape & Reel (TR) | Active | Not Verified | S12Z | 50MHz | SCI | DMA, POR, WDT | - | 31 | 16KB (16K x 8) | 16-Bit | FLASH | 128 x 8 | -40°C ~ 125°C (TA) | 2K x 8 | - | Internal | 3.5V ~ 40V | A/D 4x12b | Surface Mount | |
|
MKE02Z16VFM4IC MCU 32BIT 16KB FLASH 32QFN NXP USA Inc. |
16,833 | - |
|
数据表 |
32-VFQFN Exposed Pad | Kinetis KE02 | Tray | Active | Verified | ARM® Cortex®-M0+ | 40MHz | I2C, SPI, UART/USART | LVD, PWM, WDT | - | 28 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Surface Mount, Wettable Flank |
