| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
S9KEAZN16ACLHIC MCU 32BIT 16KB FLASH 64LQFP NXP USA Inc. |
0 | - |
|
数据表 |
64-LQFP | Kinetis KEA | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 40MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | - | 57 | 16KB (16K x 8) | 32-Bit Single-Core | FLASH | 256 x 8 | -40°C ~ 85°C (TA) | 2K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b | Surface Mount | |
|
SPC5643LF2MLQ1IC MCU 32BIT 1MB FLASH 144LQFP NXP USA Inc. |
276 | - |
|
数据表 |
144-LQFP | MPC56xx Qorivva | Tray | Active | Not Verified | e200z4 | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | - | - | 1MB (1M x 8) | 32-Bit Dual-Core | FLASH | - | -40°C ~ 125°C (TA) | 128K x 8 | - | Internal | 3V ~ 5.5V | A/D 32x12b | Surface Mount | |
|
MKL16Z256VLH4RIC MCU 32BIT 256KB FLASH 64LQFP NXP USA Inc. |
0 | - |
|
数据表 |
64-LQFP | Kinetis KL1 | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | - | 54 | 256KB (256K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 32K x 8 | - | Internal | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Surface Mount | |
|
MCF5274CVM166IC MCU 32BIT ROMLESS 256MAPBGA NXP USA Inc. |
120 | - |
|
数据表 |
256-LBGA | MCF527x | Tray | Not For New Designs | Not Verified | Coldfire V2 | 166MHz | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | DMA, WDT | - | 69 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 64K x 8 | - | External | 1.4V ~ 1.6V | - | Surface Mount | |
|
S9S08SL16F1MTLIC MCU 8BIT 16KB FLASH 28TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
28-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 22 | 16KB (16K x 8) | 8-Bit | FLASH | 256 x 8 | -40°C ~ 125°C (TA) | 512 x 8 | - | External | 2.7V ~ 5.5V | A/D 16x10b | Surface Mount | |
|
MC56F8355VFGEIC MCU 16BIT 256KB FLASH 128LQFP NXP USA Inc. |
354 | - |
|
数据表 |
128-LQFP | 56F8xxx | Tray | Active | Not Verified | 56800E | 60MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, Temp Sensor, WDT | - | 49 | 256KB (128K x 16) | 16-Bit | FLASH | - | -40°C ~ 105°C (TA) | 10K x 16 | - | External | 2.25V ~ 3.6V | A/D 16x12b | Surface Mount | |
|
MC9S12DG128CFUERIC MCU 16BIT 128KB FLASH 80QFP NXP USA Inc. |
5,883 | - |
|
数据表 |
80-QFP | HCS12 | Tape & Reel (TR) | Active | Not Verified | HCS12 | 25MHz | CANbus, I2C, SCI, SPI | PWM, WDT | - | 59 | 128KB (128K x 8) | 16-Bit | FLASH | 2K x 8 | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 2.35V ~ 5.25V | A/D 16x10b | Surface Mount | |
|
S9S12G64J0WLFRS12 CORE,64K FLASH,AU NXP USA Inc. |
0 | - |
|
数据表 |
48-LQFP | HCS12 | Tape & Reel (TR) | Active | - | S12 | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 40 | 64KB (64K x 8) | 16-Bit | FLASH | 2K x 8 | -40°C ~ 150°C (TA) | 4K x 8 | - | Internal | 3.13V ~ 5.5V | A/D 12x10b | Surface Mount | |
|
MC9S12DG128CFUEIC MCU 16BIT 128KB FLASH 80QFP NXP USA Inc. |
802 | - |
|
数据表 |
80-QFP | HCS12 | Tray | Active | Not Verified | HCS12 | 25MHz | CANbus, I2C, SCI, SPI | PWM, WDT | - | 59 | 128KB (128K x 8) | 16-Bit | FLASH | 2K x 8 | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 2.35V ~ 5.25V | A/D 16x10b | Surface Mount | |
|
S9S12G96J0MLFRIC MCU 16BIT 96KB FLASH 48LQFP NXP USA Inc. |
0 | - |
|
数据表 |
48-LQFP | HCS12 | Tape & Reel (TR) | Active | - | S12 | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 40 | 96KB (96K x 8) | 16-Bit | FLASH | 3K x 8 | -40°C ~ 125°C (TA) | 8K x 8 | - | Internal | 3.13V ~ 5.5V | A/D 12x10b | Surface Mount |