| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CYT4BFCCJDQ0BZSGSTIC MCU 32BT 8.1875MB FLSH 320BGA Infineon Technologies |
0 | - |
|
数据表 |
320-LFBGA | Traveo™ T2G | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 100MHz, 350MHz | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 240 | 8.1875MB (8.1875M x 8) | 32-Bit Quad-Core | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 1M x 8 | - | Internal | 2.7V ~ 5.5V | A/D 114x12b SAR | Surface Mount | |
|
CY91F53BCSEQ-GSAE2IC MCU Infineon Technologies |
0 | - |
|
数据表 |
- | - | Tray | Obsolete | Not Verified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
CYT4BFBCHDQ0BZSGSTIC MCU 32BT 8.1875MB FLSH 272BGA Infineon Technologies |
0 | - |
|
数据表 |
272-LFBGA | Traveo™ T2G | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 100MHz, 350MHz | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 220 | 8.1875MB (8.1875M x 8) | 32-Bit Quad-Core | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 1M x 8 | - | Internal | 2.7V ~ 5.5V | A/D 114x12b SAR | Surface Mount | |
|
TC237LP32F200SACKXUMA1IC MCU 32BIT 2MB FLASH 292LFBGA Infineon Technologies |
0 | - |
|
数据表 |
292-LFBGA | AURIX™ | Tape & Reel (TR) | Active | Not Verified | TriCore™ | 200MHz | CANbus, FlexRay, LINbus, QSPI | DMA, WDT | - | 120 | 2MB (2M x 8) | 32-Bit Single-Core | FLASH | 128K x 8 | -40°C ~ 125°C (TA) | 192K x 8 | - | External | 3.3V | A/D 24x12b | Surface Mount | |
|
CYT4BFBCHDQ0BZSGSIC MCU 32BT 8.1875MB FLSH 272BGA Infineon Technologies |
0 | - |
|
数据表 |
272-LFBGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 100MHz, 350MHz | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | 220 | 8.1875MB (8.1875M x 8) | 32-Bit Quad-Core | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 1M x 8 | - | Internal | 2.7V ~ 5.5V | A/D 114x12b SAR | Surface Mount | |
|
LTA1605BXUMA1IC MCU 16SOP Infineon Technologies |
0 | - |
|
数据表 |
- | * | Tape & Reel (TR) | Obsolete | Not Verified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
LTA1605AXUMA1IC MCU 16SOP Infineon Technologies |
0 | - |
|
数据表 |
- | * | Tape & Reel (TR) | Obsolete | Not Verified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
TC233LP32F200NACLXUMA1IC MCU 32BIT 2MB FLASH 100TQFP Infineon Technologies |
0 | - |
|
数据表 |
100-TQFP Exposed Pad | AURIX™ | Tape & Reel (TR) | Active | Not Verified | TriCore™ | 200MHz | CANbus, FlexRay, LINbus, QSPI | DMA, WDT | - | 78 | 2MB (2M x 8) | 32-Bit Single-Core | FLASH | 128K x 8 | -40°C ~ 125°C (TA) | 192K x 8 | - | External | 3.3V | A/D 24x12b | Surface Mount | |
|
S6J32HELTNSC20000TRAVEO-55NM Infineon Technologies |
0 | - |
|
数据表 |
216-LQFP Exposed Pad | Traveo™ T1G | Tray | Active | - | ARM® Cortex®-R5F | 240MHz | CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, POR, PWM, WDT | - | 128 | 4.171875MB (4.171875M x 8) | 32-Bit | FLASH | - | -40°C ~ 105°C (TA) | 2.125M x 8 | - | Internal | 1.1V ~ 5.5V | A/D 50x12b | Surface Mount | |
|
S6J311EHAASE1000AIC MCU 32BIT 4MB FLASH 176LQFP Infineon Technologies |
0 | - |
|
数据表 |
176-LQFP Exposed Pad | Traveo S6J3110 | Tray | Active | Not Verified | ARM® Cortex®-R5F | 96MHz | CANbus, CSIO, I2C, LINbus, UART/USART | DMA, LVD, POR, PWM, WDT | - | 116 | 4MB (4M x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 125°C (TA) | 88K x 8 | - | Internal | 3.5V ~ 5.25V | A/D 64x12b | Surface Mount |