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微控制器、微处理器、FPGA 模块

制造商 系列 包装 产品状态 模块/板类型 核心处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 协处理器 工作温度

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 模块/板类型 核心处理器 速度 闪存大小 RAM 大小 连接器类型 尺寸 / 尺寸 协处理器 工作温度
DC-VA-H264-10B-60-1080-MD00C-A200T

DC-VA-H264-10B-60-1080-MD00C-A200T

MOD H264 DEC 60FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

0 -
DC-VA-H264-10B-60-1080-MD00C-A200T

数据表

- Box Active DSP, FPGA Core - - 32MB 512MB SO-DIMM - Xilinx Artix-7 XC7A200T -
EC-VA-MPEG2-8B-60-1080-MD00C-A200T

EC-VA-MPEG2-8B-60-1080-MD00C-A200T

MOD MPEG2 ENC 60FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

0 -
EC-VA-MPEG2-8B-60-1080-MD00C-A200T

数据表

- Box Active DSP, FPGA Core - - 32MB 512MB SO-DIMM - Xilinx Artix-7 XC7A200T -
DC-VA-MPEG2-8B-60-1080-MD00C-A200T

DC-VA-MPEG2-8B-60-1080-MD00C-A200T

MOD MPEG2 DEC 60FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

0 -
DC-VA-MPEG2-8B-60-1080-MD00C-A200T

数据表

MPEG-2 HD Decoder Box Active FPGA Core Artix-7 XC7A200T 200MHz 32MB 512MB - - - -
TE0803-02-04CG-1EB

TE0803-02-04CG-1EB

IC MODULE ZYNQ USCALE 2GB 256MB

Trenz Electronic GmbH

0 -
TE0803-02-04CG-1EB

数据表

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E - 256MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) - 0°C ~ 85°C
TE0823-01-3PIU1ML

TE0823-01-3PIU1ML

ICOBOARD

Trenz Electronic GmbH

0 -
TE0823-01-3PIU1ML

数据表

TE0823 Bulk Active MCU, FPGA ARM Cortex-A53, ARM® Cortex®-R5 - 128MB 1GB USB 1.970" L x 1.570" W (50.00mm x 40.00mm) Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I -40°C ~ 85°C
TE0823-01-3PIU1MA

TE0823-01-3PIU1MA

ICOBOARD

Trenz Electronic GmbH

0 -
TE0823-01-3PIU1MA

数据表

TE0823 Bulk Active MCU, FPGA ARM Cortex-A53, ARM® Cortex®-R5 - 128MB 1GB USB 1.970" L x 1.570" W (50.00mm x 40.00mm) Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I -40°C ~ 85°C
TE0741-05-B2C-1-A

TE0741-05-B2C-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

0 -
TE0741-05-B2C-1-A

数据表

Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K160T-2FBG676C - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) - 0°C ~ 70°C
TE0745-02-72I31-A

TE0745-02-72I31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

0 -
TE0745-02-72I31-A

数据表

TE0745 Bulk Active MCU, FPGA ARM Cortex-A9 - 64MB 1GB Board-to-Board (BTB) Socket - 480 2.050" L x 2.990" W (52.00mm x 76.00mm) Zynq-7000 (Z-7030) -40°C ~ 85°C
TE0715-05-73E33-A

TE0715-05-73E33-A

SOC MODULE WITH XILINX ZYNQ 7030

Trenz Electronic GmbH

0 -
TE0715-05-73E33-A

数据表

TE0711 Bulk Active MPU Core Zynq™ XC7Z030-3SBG485E - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) ARM Cortex-A9 0°C ~ 85°C
TE0745-03-72I31-A

TE0745-03-72I31-A

SOM WITH AMD ZYNQ 7030-2I, 1 GBY

Trenz Electronic GmbH

0 -
TE0745-03-72I31-A

数据表

Zynq Bulk Active MPU Core ARM Cortex-A9 - 64MB 1GB Samtec ST5 2.990" L x 2.050" W (76.00mm x 52.00mm) Xilinx Zynq 7030 SoC XC7Z030-2FBG676I -40°C ~ 85°C
ME-XU5-3EG-2I-D11E-R1.2

ME-XU5-3EG-2I-D11E-R1.2

SOM ZYNQ US+ ZU3EG 2GB+1GB PL

Enclustra FPGA Solutions

0 -
ME-XU5-3EG-2I-D11E-R1.2

数据表

- Box Obsolete MPU, FPGA Core ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU 600MHz, 1.5GHz 16GB 512MB, 2GB 168 Pin 2.200" L x 2.130" W (56.00mm x 54.00mm) - -40°C ~ 85°C
L138-DI-325-RI

L138-DI-325-RI

MITYDSP-L138F SOM W/ OMAP-L138

Critical Link LLC

0 -
L138-DI-325-RI

数据表

MityDSP-L138F Bag Obsolete MPU, DSP, FPGA Core ARM926EJ-S, OMAP-L138 375MHz 256MB (NAND), 16MB (NOR) 128MB SO-DIMM-200 2.660" L x 2.000" W (67.60mm x 50.80mm) TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) -40°C ~ 85°C
TE0820-04-4DI21MA

TE0820-04-4DI21MA

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

0 -
TE0820-04-4DI21MA

数据表

- Bulk Active MPU Core ARM® Cortex®-A53, ARM® Cortex®-R5 - 128MB 2GB 1 x 60 Pin, 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) Zynq™ UltraScale+™ XCZU4EV-1SFVC784I -40°C ~ 85°C
TE0741-05-D2C-1-A

TE0741-05-D2C-1-A

MODULE FPGA KINTEX

Trenz Electronic GmbH

0 -
TE0741-05-D2C-1-A

数据表

Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K325T-2FBG676C - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) - 0°C ~ 70°C
L138-FI-336-RL

L138-FI-336-RL

MITYDSP-L138F SOM W/ OMAP-L138

Critical Link LLC

0 -
L138-FI-336-RL

数据表

MityDSP-L138F Bag Obsolete MPU, DSP, FPGA Core ARM926EJ-S, OMAP-L138 456MHz 512MB (NAND), 16MB (NOR) 256MB SO-DIMM-200 2.660" L x 2.000" W (67.60mm x 50.80mm) TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) -40°C ~ 70°C
2EC-VA-H264-10B-30-1080-MD00C-A200T

2EC-VA-H264-10B-30-1080-MD00C-A200T

MOD H264 ENC 30FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

0 -
2EC-VA-H264-10B-30-1080-MD00C-A200T

数据表

- Box Active DSP, FPGA Core - - 32MB 512MB SO-DIMM - Xilinx Artix-7 XC7A200T -
2DC-VA-H264-10B-30-1080-MD00C-A200T

2DC-VA-H264-10B-30-1080-MD00C-A200T

MOD H264 DEC 30FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

0 -
2DC-VA-H264-10B-30-1080-MD00C-A200T

数据表

- Box Active DSP, FPGA Core - - 32MB 512MB SO-DIMM - Xilinx Artix-7 XC7A200T -
2DC-VA-MPEG2-8B-30-1080-MD00C-A200T

2DC-VA-MPEG2-8B-30-1080-MD00C-A200T

MOD MPEG2 DEC 30FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

0 -
2DC-VA-MPEG2-8B-30-1080-MD00C-A200T

数据表

MPEG-2 HD Decoder Box Active FPGA Core Artix-7 XC7A200T 200MHz 32MB 512MB - - - -
2EC-VA-MPEG2-8B-30-1080-MD00C-A200T

2EC-VA-MPEG2-8B-30-1080-MD00C-A200T

MOD MPEG2 ENC 30FPS 1080 SODIMM

System-On-Chip (SOC) Technologies Inc.

0 -
2EC-VA-MPEG2-8B-30-1080-MD00C-A200T

数据表

- Box Active DSP, FPGA Core - - 32MB 512MB SO-DIMM - Xilinx Artix-7 XC7A200T -
TE0741-05-B2C-1-AF

TE0741-05-B2C-1-AF

MODULE FPGA KINTEX

Trenz Electronic GmbH

0 -
TE0741-05-B2C-1-AF

数据表

Kintex™-7 Bulk Active FPGA Xilinx Kintex-7 FPGA XC7K160T-2FFG676C - 32MB - Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) - 0°C ~ 70°C
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