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制造商 系列 包装 产品状态 连接器用途 连接器类型 位置数量 已加载位置数 间距 行数 列数 连接器样式 安装类型 端接方式 颜色 典型触点布局 触点表面处理厚度 特性 触点表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 连接器用途 连接器类型 位置数量 已加载位置数 间距 行数 列数 连接器样式 安装类型 端接方式 颜色 典型触点布局 触点表面处理厚度 特性 触点表面处理
10137002-101LF

10137002-101LF

EXAMAX RAR 4X8 NG THKWALL GXT+

Amphenol ICC (FCI)

336 -
10137002-101LF

数据表

ExaMAX® Tube Active Daughtercard Receptacle, Female Sockets 112 All - 14 8 - Board Edge, Through Hole, Right Angle Press-Fit Black - - - -
6469083-1

6469083-1

CONN HEADER HIGH SPEED 60POS PCB

TE Connectivity AMP Connectors

162 -
6469083-1

数据表

Z-PACK HM-Zd Tube Active Backplane Header, Male Pins and Blades 60 All 0.098" (2.50mm) 6 10 High Speed Through Hole Press-Fit - - 30.0µin (0.76µm) - Gold
1410270-2

1410270-2

CONN RCPT 4POS PCB

TE Connectivity AMP Connectors

102 -
1410270-2

数据表

MULTIGIG RT Tube Active Backplane Receptacle, Female Blade Sockets 4 All - 1 - - Through Hole Press-Fit Black 4 Power 50.0µin (1.27µm) - Gold
10120126-G0J-10DLF

10120126-G0J-10DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-G0J-10DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-G0J-20DLF

10120126-G0J-20DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-G0J-20DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-G0J-30DLF

10120126-G0J-30DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-G0J-30DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-G0J-40DLF

10120126-G0J-40DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-G0J-40DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-G0J-50DLF

10120126-G0J-50DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-G0J-50DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-G0J-60DLF

10120126-G0J-60DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-G0J-60DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-G0J-70DLF

10120126-G0J-70DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-G0J-70DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-G0J-80DLF

10120126-G0J-80DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-G0J-80DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-H0J-10DLF

10120126-H0J-10DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-H0J-10DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-H0J-20DLF

10120126-H0J-20DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-H0J-20DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-H0J-30DLF

10120126-H0J-30DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-H0J-30DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-H0J-40DLF

10120126-H0J-40DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-H0J-40DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-H0J-50DLF

10120126-H0J-50DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-H0J-50DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-H0J-60DLF

10120126-H0J-60DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-H0J-60DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120126-H0J-70DLF

10120126-H0J-70DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120126-H0J-70DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Guide Left Through Hole Press-Fit Black 16 Signal Pairs, 18 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
5223974-1

5223974-1

CONN HEADER BLADE PWR 3P EDGE MT

TE Connectivity AMP Connectors

0 -
5223974-1

数据表

UPM (Universal Power Modules) Tube Active Backplane Header, Male Blades 3 All - 1 - Blade Power Board Edge, Through Hole, Right Angle Press-Fit Gray 3 Power - Board Guide Gold or Gold-Palladium
2007795-1

2007795-1

IMP100S,H,V3P16C,LG,REW39,4.5

TE Connectivity AMP Connectors

0 -
2007795-1

数据表

Impact Bulk Active Backplane Header, Male Pins 144 All 0.075" (1.90mm) 9 16 Impact, Guide Left Through Hole Press-Fit Black 96 Signal, 48 Ground 30.0µin (0.76µm) Guide Pin Gold
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