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制造商 系列 包装 产品状态 连接器用途 连接器类型 位置数量 已加载位置数 间距 行数 列数 连接器样式 安装类型 端接方式 颜色 典型触点布局 触点表面处理厚度 特性 触点表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 连接器用途 连接器类型 位置数量 已加载位置数 间距 行数 列数 连接器样式 安装类型 端接方式 颜色 典型触点布局 触点表面处理厚度 特性 触点表面处理
51940-529LF

51940-529LF

CONN RCPT BLADE PWR

Amphenol ICC (FCI)

0 -
51940-529LF

数据表

PwrBlade® Tray Active - Receptacle, Female Sockets and Blade Sockets 32 All 0.100" (2.54mm) 4 - Blade Power Through Hole Solder Black 24 Signal, 8 Power 30.0µin (0.76µm) Board Lock, Guide Pin Gold
IO2-060P

IO2-060P

BRUSH CONN

Amphenol Aerospace Operations

0 -
IO2-060P

数据表

- Bulk Active - - - - - - - - - - - - - - -
51871-004LF

51871-004LF

CONN RCP BLADE PWR 6P FREE HANG

Amphenol ICC (FCI)

0 -
51871-004LF

数据表

PwrBlade® Tray Active - Receptacle, Female Blade Sockets 6 All - 1 - Blade Power Free Hanging (In-Line) Quick Connect, Disconnect Black 6 Power 30.0µin (0.76µm) Guide Pin Gold
DB3-102P

DB3-102P

BRUSH CONN

Amphenol Aerospace Operations

0 -
DB3-102P

数据表

DB3 Bulk Active Daughtercard Receptacle, Female Sockets 102 All 0.100" (2.54mm) 3 34 - Through Hole, Right Angle Solder - - - Mounting Flange Tin
10114868-00J-30B

10114868-00J-30B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-00J-30B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede® Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
M55302/166A32Y2

M55302/166A32Y2

CONN

Amphenol Aerospace Operations

0 -
M55302/166A32Y2

数据表

W Bulk Active Backplane, Motherboard Receptacle, Female Sockets 64 All 0.100" (2.54mm) 2 32 - Through Hole Solder - - - Mating Guide, Mounting Flange -
MB3-081P (703)

MB3-081P (703)

BRUSH CONN

Amphenol Aerospace Operations

0 -
MB3-081P (703)

数据表

MB3 Bulk Active Backplane Receptacle, Female Sockets 81 All 0.100" (2.54mm) 3 27 - Through Hole Solder - - 30.0µin (0.76µm) Mating Guide Gold
VRF-04-40-50-03-G

VRF-04-40-50-03-G

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
VRF-04-40-50-03-G

数据表

Versi Bulk Active Backplane Receptacle, Female Sockets 160 All 0.050" (1.27mm) 4 40 High Speed Through Hole Solder - - 50.0µin (1.27µm) Guide Pin Gold
VRM-10-20-200-50-06-N1

VRM-10-20-200-50-06-N1

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
VRM-10-20-200-50-06-N1

数据表

Versi Bulk Active Backplane Header, Male Pins 200 All 0.050" (1.27mm) 10 20 High Speed Through Hole Solder - - 50.0µin (1.27µm) Board Guide, Jackscrew Gold
VRM-10-20-200-50-00-N

VRM-10-20-200-50-00-N

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
VRM-10-20-200-50-00-N

数据表

Versi Bulk Active Backplane Header, Male Pins 200 All 0.050" (1.27mm) 10 20 High Speed Through Hole Press-Fit - - 50.0µin (1.27µm) Board Guide, Jackscrew Gold
10114868-00J-40B

10114868-00J-40B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-00J-40B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede® Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
10114868-00J-50B

10114868-00J-50B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-00J-50B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede® Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
10114868-00J-60B

10114868-00J-60B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-00J-60B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede® Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
10114868-00J-70B

10114868-00J-70B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-00J-70B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede® Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
10114868-00J-80B

10114868-00J-80B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-00J-80B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede® Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
VRM-10-20-200-50-03-N

VRM-10-20-200-50-03-N

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
VRM-10-20-200-50-03-N

数据表

Versi Bulk Active Backplane Header, Male Pins 200 All 0.050" (1.27mm) 10 20 High Speed Through Hole Solder - - 50.0µin (1.27µm) Board Guide, Jackscrew Gold
10114868-L0J-30B

10114868-L0J-30B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-L0J-30B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Left Wall Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
10114868-L0J-40B

10114868-L0J-40B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-L0J-40B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Left Wall Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
VSM-05-40-200-50-03-L

VSM-05-40-200-50-03-L

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
VSM-05-40-200-50-03-L

数据表

Versi Bulk Active Backplane Header, Male Pins 200 All 0.050" (1.27mm) 5 40 High Speed Through Hole Solder - - 50.0µin (1.27µm) Screwlocks Gold
10114868-L0J-50B

10114868-L0J-50B

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10114868-L0J-50B

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 4 XCede®, Left Wall Through Hole Press-Fit Gray 12 Differential Pairs 30.0µin (0.76µm) - Gold or Gold, GXT™
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