富聪科技订单满¥1000免运费
关注我们:

专用设备

制造商 系列 包装 产品状态 连接器用途 连接器类型 位置数量 已加载位置数 间距 行数 列数 连接器样式 安装类型 端接方式 颜色 典型触点布局 触点表面处理厚度 特性 触点表面处理

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 连接器用途 连接器类型 位置数量 已加载位置数 间距 行数 列数 连接器样式 安装类型 端接方式 颜色 典型触点布局 触点表面处理厚度 特性 触点表面处理
10120132-10E-10DLF

10120132-10E-10DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-10E-10DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede® Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-10E-40DLF

10120132-10E-40DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-10E-40DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede® Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-10E-50DLF

10120132-10E-50DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-10E-50DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede® Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-10E-60DLF

10120132-10E-60DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-10E-60DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede® Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-10E-70DLF

10120132-10E-70DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-10E-70DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede® Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-10E-80DLF

10120132-10E-80DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-10E-80DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede® Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-L0E-10DLF

10120132-L0E-10DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-L0E-10DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Left Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-L0E-20DLF

10120132-L0E-20DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-L0E-20DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Left Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-L0E-30DLF

10120132-L0E-30DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-L0E-30DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Left Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-L0E-40DLF

10120132-L0E-40DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-L0E-40DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Left Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-L0E-50DLF

10120132-L0E-50DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-L0E-50DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Left Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
M55302/168A15Y2

M55302/168A15Y2

MS BRUSH

Amphenol Aerospace Operations

0 -
M55302/168A15Y2

数据表

W Bulk Active Backplane Receptacle, Female Sockets 30 All 0.100" (2.54mm) 2 15 - Through Hole, Right Angle Solder - - - Mating Guide, Mounting Flange -
10120132-L0E-60DLF

10120132-L0E-60DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-L0E-60DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Left Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
VRF-10-20-50-04-N1

VRF-10-20-50-04-N1

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
VRF-10-20-50-04-N1

数据表

Versi Bulk Active Backplane Receptacle, Female Sockets 200 All 0.050" (1.27mm) 10 20 High Speed Through Hole Solder - - 50.0µin (1.27µm) Board Guide, Jackscrew Gold
10120132-L0E-70DLF

10120132-L0E-70DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-L0E-70DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Left Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
VRF-10-20-50-06-N1

VRF-10-20-50-06-N1

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
VRF-10-20-50-06-N1

数据表

Versi Bulk Active Backplane Receptacle, Female Sockets 200 All 0.050" (1.27mm) 10 20 High Speed Through Hole Solder - - 50.0µin (1.27µm) Board Guide, Jackscrew Gold
10120132-L0E-80DLF

10120132-L0E-80DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-L0E-80DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Left Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
10120132-M0E-10DLF

10120132-M0E-10DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-M0E-10DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Right Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
VRM-10-20-100-50-06-N1

VRM-10-20-100-50-06-N1

MOTORS & SOLENOIDS

AirBorn, Inc.

0 -
VRM-10-20-100-50-06-N1

数据表

Versi Bulk Active Backplane Header, Male Pins 200 All 0.050" (1.27mm) 10 20 High Speed Through Hole Solder - - 50.0µin (1.27µm) Board Guide, Jackscrew Gold
10120132-M0E-20DLF

10120132-M0E-20DLF

CONN HEADER XCEDE PCB

Amphenol ICC (FCI)

0 -
10120132-M0E-20DLF

数据表

XCede® Bulk Active Backplane Header, Male Pins and Blades - All - - 8 XCede®, Right Wall Through Hole Press-Fit Black 48 Signal Pairs, 52 Ground 30.0µin (0.76µm) - Gold or Gold, GXT™
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户