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| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 冷却封装 | 形状 | 长度 | 宽度 | 直径 | Fin 高度 | 附件方式 | 功耗 @ 温升 | 热阻 @ 强制气流 | 热阻 @ 自然对流 | 材质 | 材料表面处理 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SC1148ACTIVE COOLER |
775 | - |
|
数据表 |
- | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
7109DGTOP MOUNT HEATSINK .45" D2PAK |
5,401 | - |
|
数据表 |
- | Bag | Active | Top Mount | TO-263 (D²Pak) | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | 0.450" (11.43mm) | SMD Pad | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Copper | Tin |
|
BDN18-3CB/A01HEATSINK CPU W/ADHESIVE 1.81"SQ |
354 | - |
|
数据表 |
BDN | Box | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | 0.355" (9.02mm) | Thermal Tape, Adhesive (Included) | - | 3.50°C/W @ 400 LFM | 10.80°C/W | Aluminum | Black Anodized |
|
901-19-2-12-2-B-0HEATSINK 19X19X12MM PIN |
2,598 | - |
|
数据表 |
901 | Box | Active | Top Mount | BGA | Square, Pin Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | 0.457" (11.60mm) | Push Pin | - | 6.60°C/W @ 200 LFM | 12.70°C/W | Aluminum | Black Anodized |
|
APF19-19-06CB/A01HEATSINK FORGED W/ADHESIVE TAPE |
839 | - |
|
数据表 |
APF | Box | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | 0.250" (6.35mm) | Thermal Tape, Adhesive (Included) | - | 7.10°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
531002B02500GHEATSINK TO-220 W/PINS 1" TALL |
584 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | - | 0.500" (12.70mm) | Bolt On and PC Pin | 2.0W @ 30°C | 4.00°C/W @ 400 LFM | 13.40°C/W | Aluminum | Black Anodized |
|
APF19-19-10CB/A01HEATSINK FORGED W/ADHESIVE TAPE |
3,434 | - |
|
数据表 |
APF | Box | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | 0.370" (9.40mm) | Thermal Tape, Adhesive (Included) | - | 5.30°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
ATS-54270D-C1-R0HEAT SINK 27MM X 27MM X 9.5MM |
2,391 | - |
|
数据表 |
- | Bulk | Active | Top Mount | BGA | Square, Fins | 1.063" (27.00mm) | 1.063" (27.00mm) | - | 0.374" (9.50mm) | Thermal Tape, Adhesive (Included) | - | 14.10°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
ATS-CPX060060006-205-C2-R0HEATSINK 60X60X6MM XCUT CP |
213 | - |
|
数据表 |
pushPIN™ | Bulk | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | 0.236" (6.00mm) | Push Pin | - | 13.00°C/W @ 100 LFM | - | Aluminum | Blue Anodized |
|
C40-058-AEHEATSINK FOR TO-247 TO-264 |
1,168 | - |
|
数据表 |
C40 | Box | Active | Board Level, Vertical | TO-247, TO-264, SOT-227 | Rectangular, Fins | 2.283" (58.00mm) | 1.724" (43.79mm) | - | 1.260" (32.00mm) | Clip and Board Mounts | - | - | - | Aluminum | Black Anodized |
|
ATS-P1-138-C2-R0HEATSINK 25X25X15MM L-TAB T766 |
965 | - |
|
数据表 |
pushPIN™ | Bulk | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | 0.590" (15.00mm) | Push Pin | - | 12.18°C/W @ 100 LFM | - | Aluminum | Blue Anodized |
|
BDN18-6CB/A01HEATSINK CPU W/ADHESIVE 1.81"SQ |
349 | - |
|
数据表 |
BDN | Box | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | 0.605" (15.37mm) | Thermal Tape, Adhesive (Included) | - | 2.80°C/W @ 400 LFM | 8.10°C/W | Aluminum | Black Anodized |
|
|
ATS-TI1OP-521-C1-R1HEAT SINK FOR TI MOD #TPA3130D |
9,137 | - |
|
数据表 |
- | Bulk | Active | Top Mount | - | Rectangular, Fins | 1.969" (50.00mm) | 0.547" (13.89mm) | - | 0.984" (25.00mm) | Bolt On | - | 8.50°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
593002B03400GHEATSINK TWISTED FIN TO-220 |
7,169 | - |
|
数据表 |
Channel 5900 | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 1.180" (29.97mm) | 0.942" (23.93mm) | - | 0.500" (12.70mm) | Bolt On and PC Pin | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 13.40°C/W | Aluminum | Black Anodized |
|
532702B02500GHEATSINK TO-220 SOLDERPIN 50.8MM |
484 | - |
|
数据表 |
- | Bulk | Active | Board Level, Vertical | TO-220 | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | - | 1.000" (25.40mm) | Bolt On and PC Pin | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | 4.80°C/W | Aluminum | Black Anodized |
|
|
ATS-56001-C1-R0HEAT SINK 19MM X 19MM X 9MM |
2,924 | - |
|
数据表 |
maxiFLOW | Bulk | Active | Top Mount | ASIC | Square, Angled Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | 0.354" (9.00mm) | Thermal Tape, Adhesive (Included) | - | 5.30°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
APF30-30-13CB/A01HEATSINK FORGED W/ADHESIVE TAPE |
403 | - |
|
数据表 |
APF | Box | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | 0.500" (12.70mm) | Thermal Tape, Adhesive (Included) | - | 2.50°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
ATS-54150D-C1-R0HEAT SINK 15MM X 15MM X 9.5MM |
1,564 | - |
|
数据表 |
- | Bulk | Active | Top Mount | BGA | Square, Fins | 0.591" (15.00mm) | 0.591" (15.00mm) | - | 0.374" (9.50mm) | Thermal Tape, Adhesive (Included) | - | 26.20°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
APF40-40-06CB/A01HEATSINK FORGED W/ADHESIVE TAPE |
608 | - |
|
数据表 |
APF | Box | Active | Top Mount | Assorted (BGA, LGA, CPU, ASIC...) | Square, Fins | 1.575" (40.00mm) | 1.575" (40.00mm) | - | 0.250" (6.35mm) | Thermal Tape, Adhesive (Included) | - | 3.30°C/W @ 200 LFM | - | Aluminum | Black Anodized |
|
ATS-55170D-C1-R0HEAT SINK 17MM X 17MM X 9.5MM |
2,059 | - |
|
数据表 |
- | Bulk | Active | Top Mount | BGA | Square, Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | - | 0.374" (9.50mm) | Thermal Tape, Adhesive (Included) | - | 28.00°C/W @ 200 LFM | - | Aluminum | Black Anodized |
