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射频收发模块和调制解调器

制造商 系列 封装/外壳 包装 产品状态 可编程 射频系列/标准 调制 频率 数据速率 安装类型 功率 - 输出 灵敏度 协议 串行接口 天线类型 电流 - 发送 使用的 IC / 部件 工作温度 电流 - 接收 存储容量 电压 - 电源

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 可编程 射频系列/标准 调制 频率 数据速率 安装类型 功率 - 输出 灵敏度 协议 串行接口 天线类型 电流 - 发送 使用的 IC / 部件 工作温度 电流 - 接收 存储容量 电压 - 电源
BDE-MP2652R7N32

BDE-MP2652R7N32

RF TXRX MODULE BLUETOOTH PCB SMD

BDE Technology

22 -
BDE-MP2652R7N32

数据表

- - Tape & Reel (TR) Active - - - - - - - - - - - - - - - - -
BDE-MB1352P71UU32

BDE-MB1352P71UU32

RF TXRX MODULE BT U.FL, U.FL SMD

BDE Technology

22 -
BDE-MB1352P71UU32

数据表

- 42-SMD Module Tape & Reel (TR) Active - 802.15.4, Bluetooth, General ISM > 1GHz 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, MSK, OOK 861MHz ~ 1.054GHz, 2.36GHz ~ 2.5GHz 125kbps Surface Mount 20dBm -121dBm 6LoWPAN, Bluetooth v5.0, Thread, Wireless M-Bus, Wi-SUN, Zigbee® ADC, DAC, GPIO, I2C, I2S, SSI, UART Antenna Not Included, U.FL 24.9mA ~ 64mA CC1352P7 -40°C ~ 85°C 5.4mA ~ 6.4mA 144kB RAM 1.8V ~ 3.8V
BDE-MP2674R10N32

BDE-MP2674R10N32

CC2674R10 MUTI-BAND MUTI-PROTOCO

BDE Technology

22 -
BDE-MP2674R10N32

数据表

- 39-SMD Module Tape & Reel (TR) Active - 802.15.4, Bluetooth, General ISM < 1GHz 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, MSK, O-QPSK 2.4GHz 2Mbps Surface Mount 5dBm -104dBm 6LoWPAN, Bluetooth v5.3, Thread, Zigbee® ADC, GPIO, I2C, I2S, SPI, UART Antenna Not Included 7.3mA ~ 9.8mA CC2674R10 -40°C ~ 85°C 6.4mA 32MB Flash, 256kB RAM 1.8V ~ 3.8V
BDE-MP2674P10U32

BDE-MP2674P10U32

CC2674P10 MUTI-BAND MUTI-PROTOCO

BDE Technology

21 -
BDE-MP2674P10U32

数据表

- 42-SMD Module Tape & Reel (TR) Active - 802.15.4, Bluetooth 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, O-QPSK 2.4GHz 125kbps Surface Mount 20dBm -105dBm Bluetooth v5.3, Zigbee® GPIO, I2C, I2S, SPI, UART Antenna Not Included, U.FL 7.3mA ~ 101mA CC2674P10 -40°C ~ 85°C 6.4mA 32MB Flash, 256kB RAM 1.8V ~ 3.8V
BDE-MB1354P101UN32

BDE-MB1354P101UN32

RF TXRX MOD BT INT PCB +U.FL SMD

BDE Technology

21 -
BDE-MB1354P101UN32

数据表

- 42-SMD Module Tape & Reel (TR) Active - 802.15.4, Bluetooth, General ISM < 1GHz 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, MSK, OOK, O-QPSK 2.4GHz 125kbps Surface Mount 20dBm -121dBm 6LoWPAN, Bluetooth v5.2, Thread, Wireless M-Bus, Wi-SUN, Zigbee® ADC, GPIO, I2C, I2S, SPI, UART Integrated, Chip + U.FL 9.6mA ~ 69mA CC1354P10 -40°C ~ 85°C 5.8mA ~ 6.9mA 32MB Flash, 256kB RAM 1.8V ~ 3.8V
BDE-MP2652R7U32

BDE-MP2652R7U32

RF TXRX MODULE BLUETOOTH PCB SMD

BDE Technology

20 -
BDE-MP2652R7U32

数据表

- - Tape & Reel (TR) Active - - - - - - - - - - - - - - - - -
BDE-MB1352P71NN32

BDE-MB1352P71NN32

RF TXRX MODULE BT RF PAD PCB SMD

BDE Technology

19 -
BDE-MB1352P71NN32

数据表

- 42-SMD Module Tape & Reel (TR) Active - 802.15.4, Bluetooth, General ISM > 1GHz 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, MSK, OOK 861MHz ~ 1.054GHz, 2.36GHz ~ 2.5GHz 125kbps Surface Mount 20dBm -121dBm 6LoWPAN, Bluetooth v5.0, Thread, Wireless M-Bus, Wi-SUN, Zigbee® ADC, DAC, GPIO, I2C, I2S, SSI, UART Antenna Not Included 24.9mA ~ 64mA CC1352P7 -40°C ~ 85°C 5.4mA ~ 6.4mA 144kB RAM 1.8V ~ 3.8V
BDE-SG1312R7U32

BDE-SG1312R7U32

RF TXRX MODULE RF PAD SMD

BDE Technology

19 -
BDE-SG1312R7U32

数据表

- 39-SMD Module Tape & Reel (TR) Active - 802.15.4 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, MSK, OOK 868MHz, 915MHz 50kbps Surface Mount 14dBm -122dBm 6LoWPAN, Wireless M-Bus, Wi-SUN, Zigbee® ADC, DAC, GPIO, I2C, I2S, SSI, UART Antenna Not Included, U.FL 24.9mA CC1312R7 -40°C ~ 85°C 5.4mA 144kB RAM 1.8V ~ 3.8V
BDE-BW3351AP1-IN

BDE-BW3351AP1-IN

RF TXRX MODULE BLUETOOTH SMD

BDE Technology

17 -
BDE-BW3351AP1-IN

数据表

- 64-SMD Module Tape & Reel (TR) Active - Bluetooth, WiFi OFDM 2.4GHz, 5GHz 50Mbps Surface Mount 20dBm - IEEE 802.11 b/g/n/ax, Bluetooth Low Energy 5.2 SDIO, SPI, UART PCB Trace 92mA ~ 250mA CC3351 -40°C ~ 105°C 0mA ~ 62mA - 2.1V ~ 4.2V
BDE-MP2674P10A32

BDE-MP2674P10A32

RF TXRX MOD BT PCB TH SMD

BDE Technology

16 -
BDE-MP2674P10A32

数据表

- 42-SMD Module Tape & Reel (TR) Active - Bluetooth 2-GFSK, 4-GFSK, MSK 2.4GHz 125kbps Surface Mount 20dBm -104dBm Bluetooth v5.3 ADC, GPIO, I2C, I2S, SPI, UART PCB Trace 7.3mA ~ 101mA CC2674P10 -40°C ~ 85°C 6.4mA 4MB Flash, 256kB SRAM 1.8V ~ 3.8V
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