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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
AGIB027R31A1E2VB

AGIB027R31A1E2VB

IC FPGA AGILEX-I 3184FBGA

Intel

0 -
AGIB027R31A1E2VB

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB027R31A2E1VB

AGIB027R31A2E1VB

IC FPGA AGILEX-I 3184FBGA

Intel

0 -
AGIB027R31A2E1VB

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
XCVC1902-2LLEVSVD1760

XCVC1902-2LLEVSVD1760

IC VERSAL AICORE FPGA 1760BGA

AMD

0 -
XCVC1902-2LLEVSVD1760

数据表

Versal™ AI Core 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ AI Core FPGA, 1.9M Logic Cells - 0°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
XCVC1902-1LLIVSVD1760

XCVC1902-1LLIVSVD1760

IC VERSAL AICORE FPGA 1760BGA

AMD

0 -
XCVC1902-1LLIVSVD1760

数据表

Versal™ AI Core 1760-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ AI Core FPGA, 1.9M Logic Cells - -40°C ~ 100°C (TJ) - - 1760-FCBGA (40x40)
XCVC1902-2MLIVIVA1596

XCVC1902-2MLIVIVA1596

IC VERSAL AICORE FPGA 1596BGA

AMD

0 -
XCVC1902-2MLIVIVA1596

数据表

Versal™ AI Core 1596-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ AI Core FPGA, 1.9M Logic Cells - -40°C ~ 100°C (TJ) - - 1596-FCBGA (40x40)
XCVC1902-2HSIVIVA1596

XCVC1902-2HSIVIVA1596

IC VERSAL AI-CORE FPGA 1596BGA

AMD

0 -
XCVC1902-2HSIVIVA1596

数据表

Versal™ AI Core 1596-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz, 1.65GHz Versal™ AI Core FPGA, 1.9M Logic Cells - -40°C ~ 100°C (TJ) - - 1596-FCBGA (40x40)
AGID023R18A1I2V

AGID023R18A1I2V

IC FPGA AGILEX-I 1805FBGA

Intel

0 -
AGID023R18A1I2V

数据表

Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGID023R18A2I1V

AGID023R18A2I1V

IC FPGA AGILEX-I 1805FBGA

Intel

0 -
AGID023R18A2I1V

数据表

Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGID023R18A2I1VB

AGID023R18A2I1VB

IC FPGA AGILEX-I 1805BGA

Intel

0 -
AGID023R18A2I1VB

数据表

Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGID023R18A1I2VB

AGID023R18A1I2VB

IC FPGA AGILEX-I 1805BGA

Intel

0 -
AGID023R18A1I2VB

数据表

Agilex I 1805-BBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - -40°C ~ 100°C (TJ) - - 1805-BGA (42.5x42.5)
AGID023R31B1E1V

AGID023R31B1E1V

IC FPGA AGILEX-I 3184FBGA

Intel

0 -
AGID023R31B1E1V

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGID023R31B1E1VB

AGID023R31B1E1VB

IC FPGA AGILEX-I 3184BGA

Intel

0 -
AGID023R31B1E1VB

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
XCZU46DR-L2FFVH1760I

XCZU46DR-L2FFVH1760I

IC ZUP RFSOC A53 FPGA LP 1760BGA

AMD

0 -
XCZU46DR-L2FFVH1760I

数据表

Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU46DR-L2FSVH1760I

XCZU46DR-L2FSVH1760I

IC ZUP RFSOC A53 FPGA LP 1760BGA

AMD

0 -
XCZU46DR-L2FSVH1760I

数据表

Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
AGFA027R31C2I1V

AGFA027R31C2I1V

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFA027R31C2I1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFA027R31C2I1VB

AGFA027R31C2I1VB

IC FPGA AGILEX-F 3184BGA

Intel

0 -
AGFA027R31C2I1VB

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGFB027R31C2I1VAA

AGFB027R31C2I1VAA

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFB027R31C2I1VAA

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFB027R31C2I1V

AGFB027R31C2I1V

IC FPGA AGILEX-F 3184FBGA

Intel

0 -
AGFB027R31C2I1V

数据表

Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - -
AGFB027R31C2I1VB

AGFB027R31C2I1VB

IC FPGA AGILEX-F 3184BGA

Intel

0 -
AGFB027R31C2I1VB

数据表

Agilex F 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - -40°C ~ 100°C (TJ) - - 3184-BGA (56x45)
AGIB027R31A1E1V

AGIB027R31A1E1V

AGIB027R31A1E1V

Intel

0 -
AGIB027R31A1E1V

数据表

Agilex I 3184-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements - 0°C ~ 100°C (TJ) - - 3184-BGA (56x45)
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