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系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装

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图片 厂商料号 库存情况 价格 数量 数据表 系列 封装/外壳 包装 产品状态 架构 核心处理器 RAM 大小 外设 连接性 速度 主要属性 闪存大小 工作温度 等级 认证 供应商设备封装
XCVC1702-2HSIVSVA1596

XCVC1702-2HSIVSVA1596

XCVC1702-2HSIVSVA1596

AMD

0 -
XCVC1702-2HSIVSVA1596

数据表

Virtex® UltraScale+™ 1596-BFBGA, FCBGA Bulk Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 800MHz, 1.65GHz Versal™ AI Core FPGA, 1M Logic Cells - -40°C ~ 110°C (TJ) - - 1596-FCBGA (37.5x37.5)
XCZU47DR-L2FFVG1517I

XCZU47DR-L2FFVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD

0 -
XCZU47DR-L2FFVG1517I

数据表

Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU47DR-L2FSVG1517I

XCZU47DR-L2FSVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD

0 -
XCZU47DR-L2FSVG1517I

数据表

Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU43DR-L2FSVG1517I

XCZU43DR-L2FSVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD

0 -
XCZU43DR-L2FSVG1517I

数据表

Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU43DR-L2FFVG1517I

XCZU43DR-L2FFVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD

0 -
XCZU43DR-L2FFVG1517I

数据表

Zynq® UltraScale+™ RFSoC 1517-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1517-FCBGA (40x40)
XCZU46DR-2FSVH1760I

XCZU46DR-2FSVH1760I

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

0 -
XCZU46DR-2FSVH1760I

数据表

Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCZU46DR-2FFVH1760I

XCZU46DR-2FFVH1760I

IC ZUP RFSOC A53 FPGA 1760BGA

AMD

0 -
XCZU46DR-2FFVH1760I

数据表

Zynq® UltraScale+™ RFSoC 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells - -40°C ~ 100°C (TJ) - - 1760-FCBGA (42.5x42.5)
XCVP1402-2LLEVSVA3340

XCVP1402-2LLEVSVA3340

IC VERSAL PREM ACAP FPGA 3340BGA

AMD

0 -
XCVP1402-2LLEVSVA3340

数据表

Versal® Premium 3340-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ Premium FPGA, 2.2M Logic Cells - 0°C ~ 110°C (TJ) - - 3340-FCBGA (55x55)
XCVP1402-1LLIVSVA3340

XCVP1402-1LLIVSVA3340

IC VERSAL PREM ACAP FPGA 3340BGA

AMD

0 -
XCVP1402-1LLIVSVA3340

数据表

Versal® Premium 3340-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ Premium FPGA, 2.2M Logic Cells - -40°C ~ 110°C (TJ) - - 3340-FCBGA (55x55)
XCVC1902-1LSIVSVA2197

XCVC1902-1LSIVSVA2197

IC VERSAL AICORE FPGA 2197BGA

AMD

0 -
XCVC1902-1LSIVSVA2197

数据表

Versal™ AI Core 2197-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ AI Core FPGA, 1.9M Logic Cells - -40°C ~ 100°C (TJ) - - 2197-FCBGA (45x45)
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