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图片 厂商料号 库存情况 价格 数量 数据表 封装/外壳 系列 包装 产品状态 可编程 核心处理器 速度 连接性 外设 等级 I/O 数量 程序存储器大小 核心大小 程序存储器类型 EEPROM 大小 工作温度 RAM 大小 认证 振荡器类型 电压 - 供应(Vcc/Vdd) 数据转换器 安装类型 供应商设备封装
MCF54453VR266

MCF54453VR266

IC MCU 32BIT ROMLESS 360TEPBGA

NXP USA Inc.

0 -
MCF54453VR266

数据表

360-BBGA MCF5445x Tray Obsolete Not Verified Coldfire V4 266MHz I2C, SPI, SSI, UART/USART, USB OTG DMA, WDT - 132 - 32-Bit Single-Core ROMless - 0°C ~ 70°C (TA) 32K x 8 - Internal 1.35V ~ 3.6V - Surface Mount
MCF54454VR266

MCF54454VR266

IC MCU 32BIT ROMLESS 360TEPBGA

NXP USA Inc.

0 -
MCF54454VR266

数据表

360-BBGA MCF5445x Tray Obsolete Not Verified Coldfire V4 266MHz I2C, SPI, SSI, UART/USART, USB OTG DMA, WDT - 132 - 32-Bit Single-Core ROMless - 0°C ~ 70°C (TA) 32K x 8 - Internal 1.35V ~ 3.6V - Surface Mount
MCF54455VR266

MCF54455VR266

IC MCU 32BIT ROMLESS 360TEPBGA

NXP USA Inc.

0 -
MCF54455VR266

数据表

360-BBGA MCF5445x Tray Obsolete Not Verified Coldfire V4 266MHz I2C, SPI, SSI, UART/USART, USB OTG DMA, WDT - 132 - 32-Bit Single-Core ROMless - 0°C ~ 70°C (TA) 32K x 8 - Internal 1.35V ~ 3.6V - Surface Mount
MCF54454CVR200

MCF54454CVR200

IC MCU 32BIT ROMLESS 360TEPBGA

NXP USA Inc.

0 -
MCF54454CVR200

数据表

360-BBGA MCF5445x Tray Obsolete Not Verified Coldfire V4 200MHz I2C, SPI, SSI, UART/USART, USB OTG DMA, WDT - 132 - 32-Bit Single-Core ROMless - -40°C ~ 85°C (TA) 32K x 8 - Internal 1.35V ~ 3.6V - Surface Mount
MCF54455CVR200

MCF54455CVR200

IC MCU 32BIT ROMLESS 360TEPBGA

NXP USA Inc.

0 -
MCF54455CVR200

数据表

360-BBGA MCF5445x Tray Obsolete Not Verified Coldfire V4 200MHz I2C, SPI, SSI, UART/USART, USB OTG DMA, WDT - 132 - 32-Bit Single-Core ROMless - -40°C ~ 85°C (TA) 32K x 8 - Internal 1.35V ~ 3.6V - Surface Mount
MCF54452CVR200

MCF54452CVR200

IC MCU 32BIT ROMLESS 360TEPBGA

NXP USA Inc.

0 -
MCF54452CVR200

数据表

360-BBGA MCF5445x Tray Obsolete Not Verified Coldfire V4 200MHz I2C, SPI, SSI, UART/USART, USB OTG DMA, WDT - 132 - 32-Bit Single-Core ROMless - -40°C ~ 85°C (TA) 32K x 8 - Internal 1.35V ~ 3.6V - Surface Mount
LPC2387FBD100,551

LPC2387FBD100,551

IC MCU 16/32B 512KB FLSH 100LQFP

NXP USA Inc.

0 -
LPC2387FBD100,551

数据表

100-LQFP LPC2300 Tray Discontinued at Digi-Key Not Verified ARM7® 72MHz CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT - 70 512KB (512K x 8) 16/32-Bit FLASH - -40°C ~ 85°C (TA) 98K x 8 - Internal 3V ~ 3.6V A/D 6x10b; D/A 1x10b Surface Mount
LPC2388FBD144,551

LPC2388FBD144,551

IC MCU 16/32B 512KB FLSH 144LQFP

NXP USA Inc.

0 -
LPC2388FBD144,551

数据表

144-LQFP LPC2300 Tray Discontinued at Digi-Key Not Verified ARM7® 72MHz CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT - 104 512KB (512K x 8) 16/32-Bit FLASH - -40°C ~ 85°C (TA) 98K x 8 - Internal 3V ~ 3.6V A/D 8x10b; D/A 1x10b Surface Mount
LPC2917FBD144,551

LPC2917FBD144,551

IC MCU 16/32B 512KB FLSH 144LQFP

NXP USA Inc.

0 -
LPC2917FBD144,551

数据表

144-LQFP LPC2900 Tray Obsolete Not Verified ARM9® 80MHz CANbus, EBI/EMI, LINbus, SPI, UART/USART POR, PWM, WDT - 108 512KB (512K x 8) 16/32-Bit FLASH - -40°C ~ 85°C (TA) 80K x 8 - Internal 1.71V ~ 3.6V A/D 16x10b Surface Mount
LPC2919FBD144,551

LPC2919FBD144,551

IC MCU 16/32B 768KB FLSH 144LQFP

NXP USA Inc.

0 -
LPC2919FBD144,551

数据表

144-LQFP LPC2900 Tray Obsolete Not Verified ARM9® 80MHz CANbus, EBI/EMI, LINbus, SPI, UART/USART POR, PWM, WDT - 108 768KB (768K x 8) 16/32-Bit FLASH - -40°C ~ 85°C (TA) 80K x 8 - Internal 1.71V ~ 3.6V A/D 16x10b Surface Mount
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