| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MCF54453VR266IC MCU 32BIT ROMLESS 360TEPBGA NXP USA Inc. |
0 | - |
|
数据表 |
360-BBGA | MCF5445x | Tray | Obsolete | Not Verified | Coldfire V4 | 266MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | 132 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C (TA) | 32K x 8 | - | Internal | 1.35V ~ 3.6V | - | Surface Mount | |
|
MCF54454VR266IC MCU 32BIT ROMLESS 360TEPBGA NXP USA Inc. |
0 | - |
|
数据表 |
360-BBGA | MCF5445x | Tray | Obsolete | Not Verified | Coldfire V4 | 266MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | 132 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C (TA) | 32K x 8 | - | Internal | 1.35V ~ 3.6V | - | Surface Mount | |
|
MCF54455VR266IC MCU 32BIT ROMLESS 360TEPBGA NXP USA Inc. |
0 | - |
|
数据表 |
360-BBGA | MCF5445x | Tray | Obsolete | Not Verified | Coldfire V4 | 266MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | 132 | - | 32-Bit Single-Core | ROMless | - | 0°C ~ 70°C (TA) | 32K x 8 | - | Internal | 1.35V ~ 3.6V | - | Surface Mount | |
|
MCF54454CVR200IC MCU 32BIT ROMLESS 360TEPBGA NXP USA Inc. |
0 | - |
|
数据表 |
360-BBGA | MCF5445x | Tray | Obsolete | Not Verified | Coldfire V4 | 200MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | 132 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 32K x 8 | - | Internal | 1.35V ~ 3.6V | - | Surface Mount | |
|
MCF54455CVR200IC MCU 32BIT ROMLESS 360TEPBGA NXP USA Inc. |
0 | - |
|
数据表 |
360-BBGA | MCF5445x | Tray | Obsolete | Not Verified | Coldfire V4 | 200MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | 132 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 32K x 8 | - | Internal | 1.35V ~ 3.6V | - | Surface Mount | |
|
MCF54452CVR200IC MCU 32BIT ROMLESS 360TEPBGA NXP USA Inc. |
0 | - |
|
数据表 |
360-BBGA | MCF5445x | Tray | Obsolete | Not Verified | Coldfire V4 | 200MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | 132 | - | 32-Bit Single-Core | ROMless | - | -40°C ~ 85°C (TA) | 32K x 8 | - | Internal | 1.35V ~ 3.6V | - | Surface Mount | |
|
LPC2387FBD100,551IC MCU 16/32B 512KB FLSH 100LQFP NXP USA Inc. |
0 | - |
|
数据表 |
100-LQFP | LPC2300 | Tray | Discontinued at Digi-Key | Not Verified | ARM7® | 72MHz | CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | - | 70 | 512KB (512K x 8) | 16/32-Bit | FLASH | - | -40°C ~ 85°C (TA) | 98K x 8 | - | Internal | 3V ~ 3.6V | A/D 6x10b; D/A 1x10b | Surface Mount | |
|
LPC2388FBD144,551IC MCU 16/32B 512KB FLSH 144LQFP NXP USA Inc. |
0 | - |
|
数据表 |
144-LQFP | LPC2300 | Tray | Discontinued at Digi-Key | Not Verified | ARM7® | 72MHz | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | - | 104 | 512KB (512K x 8) | 16/32-Bit | FLASH | - | -40°C ~ 85°C (TA) | 98K x 8 | - | Internal | 3V ~ 3.6V | A/D 8x10b; D/A 1x10b | Surface Mount | |
|
LPC2917FBD144,551IC MCU 16/32B 512KB FLSH 144LQFP NXP USA Inc. |
0 | - |
|
数据表 |
144-LQFP | LPC2900 | Tray | Obsolete | Not Verified | ARM9® | 80MHz | CANbus, EBI/EMI, LINbus, SPI, UART/USART | POR, PWM, WDT | - | 108 | 512KB (512K x 8) | 16/32-Bit | FLASH | - | -40°C ~ 85°C (TA) | 80K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 16x10b | Surface Mount | |
|
LPC2919FBD144,551IC MCU 16/32B 768KB FLSH 144LQFP NXP USA Inc. |
0 | - |
|
数据表 |
144-LQFP | LPC2900 | Tray | Obsolete | Not Verified | ARM9® | 80MHz | CANbus, EBI/EMI, LINbus, SPI, UART/USART | POR, PWM, WDT | - | 108 | 768KB (768K x 8) | 16/32-Bit | FLASH | - | -40°C ~ 85°C (TA) | 80K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 16x10b | Surface Mount |