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微控制器
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 速度 | 连接性 | 外设 | 等级 | I/O 数量 | 程序存储器大小 | 核心大小 | 程序存储器类型 | EEPROM 大小 | 工作温度 | RAM 大小 | 认证 | 振荡器类型 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC9S08SE8CWLIC MCU 8BIT 8KB FLASH 28SOIC NXP USA Inc. |
1,098 | - |
|
数据表 |
28-SOIC (0.295", 7.50mm Width) | S08 | Tube | Active | Not Verified | S08 | 20MHz | LINbus, SCI | LVD, POR, PWM | - | 24 | 8KB (8K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 512 x 8 | - | Internal | 2.7V ~ 5.5V | A/D 10x10b | Surface Mount | |
|
MKE02Z64VLC4IC MCU 32BIT 64KB FLASH 32LQFP NXP USA Inc. |
2,877 | - |
|
数据表 |
32-LQFP | Kinetis KE02 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 40MHz | I2C, SPI, UART/USART | LVD, PWM, WDT | - | 28 | 64KB (64K x 8) | 32-Bit Single-Core | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 4K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Surface Mount | |
|
LPC1114FHN33/301:5IC MCU 32BIT 32KB FLASH 32HVQFN NXP USA Inc. |
5,484 | - |
|
数据表 |
32-VQFN Exposed Pad | LPC1100 | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 28 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
MKE02Z64VLD4IC MCU 32BIT 64KB FLASH 44LQFP NXP USA Inc. |
4,495 | - |
|
数据表 |
44-LQFP | Kinetis KE02 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 40MHz | I2C, SPI, UART/USART | LVD, PWM, WDT | - | 37 | 64KB (64K x 8) | 32-Bit Single-Core | FLASH | 256 x 8 | -40°C ~ 105°C (TA) | 4K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Surface Mount | |
|
MKL05Z32VFK4IC MCU 32BIT 32KB FLASH 24QFN NXP USA Inc. |
2,450 | - |
|
数据表 |
24-VFQFN Exposed Pad | Kinetis KL0 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 48MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | - | 22 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 105°C (TA) | 4K x 8 | - | Internal | 1.71V ~ 3.6V | A/D 12x12b; D/A 1x12b | Surface Mount | |
|
MC9S08QG8CDTERIC MCU 8BIT 8KB FLASH 16TSSOP NXP USA Inc. |
0 | - |
|
数据表 |
16-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Verified | S08 | 20MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | - | 12 | 8KB (8K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 512 x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b | Surface Mount | |
|
S9S12G96F0CLFIC MCU 16BIT 96KB FLASH 48LQFP NXP USA Inc. |
1,149 | - |
|
数据表 |
48-LQFP | HCS12 | Tray | Active | Not Verified | 12V1 | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 40 | 96KB (96K x 8) | 16-Bit | FLASH | 3K x 8 | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 3.13V ~ 5.5V | A/D 12x10b | Surface Mount | |
|
MC9S08SH32CTLIC MCU 8BIT 32KB FLASH 28TSSOP NXP USA Inc. |
450 | - |
|
数据表 |
28-TSSOP (0.173", 4.40mm Width) | S08 | Tube | Active | Not Verified | S08 | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | - | 23 | 32KB (32K x 8) | 8-Bit | FLASH | - | -40°C ~ 85°C (TA) | 1K x 8 | - | Internal | 2.7V ~ 5.5V | A/D 16x10b | Surface Mount | |
|
|
LPC11C14FBD48/30ELIC MCU 32BIT 32KB FLASH 48LQFP NXP USA Inc. |
181 | - |
|
数据表 |
48-LQFP | LPC11Cxx | Tray | Active | Not Verified | ARM® Cortex®-M0 | 50MHz | CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 40 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 1.8V ~ 3.6V | A/D 8x10b SAR | Surface Mount | |
|
|
LPC1313FHN33,551IC MCU 32BIT 32KB FLASH 32VQFN NXP USA Inc. |
25,820 | - |
|
数据表 |
32-VQFN Exposed Pad | LPC13xx | Tray | Active | Not Verified | ARM® Cortex®-M3 | 72MHz | I2C, Microwire, SPI, SSI, UART/USART | Brown-out Detect/Reset, POR, WDT | - | 28 | 32KB (32K x 8) | 32-Bit Single-Core | FLASH | - | -40°C ~ 85°C (TA) | 8K x 8 | - | Internal | 2V ~ 3.6V | A/D 8x10b | Surface Mount |
